APA (7th ed.) Citation

Gong, J., Liu, C., Conway, P., & Silberschmidt, V. (2006). Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints.

Chicago Style (17th ed.) Citation

Gong, Jicheng, Changqing Liu, Paul Conway, and Vadim Silberschmidt. Grain Features of SnAgCu Solder and Their Effect on Mechanical Behaviour of Micro-joints. 2006.

MLA (9th ed.) Citation

Gong, Jicheng, et al. Grain Features of SnAgCu Solder and Their Effect on Mechanical Behaviour of Micro-joints. 2006.

Warning: These citations may not always be 100% accurate.