Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints

SnAgCu alloy, which promises compatible properties with Sn-Pb solder, has been identified as one of the most potential Lead-free solders for electronic interconnections. However, due to the miniaturization of solder joints, a micro-joint of this material contains only few grains. In this case, the m...

Full description

Bibliographic Details

Main Authors:	Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt
Format:	Default Conference proceeding
Published:	2006
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/5335
Tags:	Add Tag No Tags, Be the first to tag this record!