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Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints

It is well known that in surface mount technology (SMT), thermal strains in electronic assemblies are induced in the solder joints by the mismatch between the coefficients of thermal expansion (CTE) of the components, substrate and solder, both during their processing and in service. Therefore, ther...

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Bibliographic Details
Main Authors:	Pradeep Hegde, David Whalley, Vadim Silberschmidt
Format:	Default Conference proceeding
Published:	2008
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/4214
Tags:	Add Tag No Tags, Be the first to tag this record!

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