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The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrate
In this work, the effect of temperature ramp rate on flip-chip anisotropically conductive adhesive joint quality and reliability has been studied. The experiments were performed on bumped and unbumped die. They were assembled onto bare ITO-glass and FR-4 substrates. The reason for using the transpar...
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| Main Authors: | , , , , , |
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| Format: | Default Article |
| Published: |
1997
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/3986 |
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