Loading…
The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applications
The ability of alkanethiol monolayers deposited on copper to prevent surface oxidation has suggested their application as preservatives for fluxless soldering. However, the utility of such coatings for this purpose will critically depend on their ability to continue to preserve the substrate during...
Saved in:
Main Authors: | Stephen Ebbens, David Hutt, Changqing Liu |
---|---|
Format: | Default Article |
Published: |
2010
|
Subjects: | |
Online Access: | https://hdl.handle.net/2134/7129 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
Loading…
The role of self-assembled monolayers in the surface modification and interfacial contact of copper fillers in electrically conductive adhesives
by: Shanda Wang, et al.
Published: (2023)
by: Shanda Wang, et al.
Published: (2023)
Loading…
Automated adaptive control of the reflow soldering of electronic assemblies
by: Paul Conway, et al.
Published: (1997)
by: Paul Conway, et al.
Published: (1997)
Loading…
Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging
by: Canyu Liu, et al.
Published: (2021)
by: Canyu Liu, et al.
Published: (2021)
Loading…
Dry and wet nano-scale impact dynamics of rough surfaces with or without a self-assembled monolayer
by: M. Teodorescu, et al.
Published: (2007)
by: M. Teodorescu, et al.
Published: (2007)
Loading…
Electrical conduction stability of copper-filled adhesives in high-moisture environments
by: Shanda Wang
Published: (2020)
by: Shanda Wang
Published: (2020)
Loading…
Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy
by: Zhaoxia Zhou, et al.
Published: (2018)
by: Zhaoxia Zhou, et al.
Published: (2018)
Loading…
Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging
by: Zhiwen Chen, et al.
Published: (2015)
by: Zhiwen Chen, et al.
Published: (2015)
Loading…
Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation
by: John E. Graves, et al.
Published: (2015)
by: John E. Graves, et al.
Published: (2015)
Loading…
Electrodeposition and characterisation of lead-free solder alloys for electronics interconnection
by: Yi Qin
Published: (2010)
by: Yi Qin
Published: (2010)
Loading…
Concentration polarization effect at the deposition of charged Langmuir monolayers
by: V.I. Kovalchuk, et al.
Published: (2011)
by: V.I. Kovalchuk, et al.
Published: (2011)
Loading…
Corrosion characterization of tin–lead and lead-free solders in 3.5 wt.% NaCl solution
by: Dezhi Li, et al.
Published: (2008)
by: Dezhi Li, et al.
Published: (2008)
Loading…
Materials issues in the transition to lead-free solder alloys and joint miniaturization
by: Zhiheng Huang
Published: (2005)
by: Zhiheng Huang
Published: (2005)
Loading…
Microstructural and micromechanical characteristics of tin-based solders under self-propagating exothermic reaction heating
by: Zheng Zhou, et al.
Published: (2020)
by: Zheng Zhou, et al.
Published: (2020)
Loading…
Towards an Assembly Reference Ontology for Assembly Knowledge Sharing
by: Muhammad Imran
Published: (2013)
by: Muhammad Imran
Published: (2013)
Loading…
Reliability assessment of a digital electronic board assembly using the physics-of-failure approach: a case study
by: Chucks N. Oguibe, et al.
Published: (1999)
by: Chucks N. Oguibe, et al.
Published: (1999)
Loading…
A simplified model of the reflow soldering process
by: David Whalley
Published: (2002)
by: David Whalley
Published: (2002)
Loading…
Formation of Ag3Sn plates in SnAgCu solder bumps
by: Jicheng Gong, et al.
Published: (2010)
by: Jicheng Gong, et al.
Published: (2010)
Loading…
Reliability-based design methodology for reusable modular assembly systems
by: Paul Danny
Published: (2021)
by: Paul Danny
Published: (2021)
Loading…
Soldering interconnects through self-propagating reaction process
by: Wenbo Zhu
Published: (2016)
by: Wenbo Zhu
Published: (2016)
Loading…
Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnects
by: Jianfeng Li, et al.
Published: (2008)
by: Jianfeng Li, et al.
Published: (2008)
Loading…
An investigation into the effect of dry bake on the solderability degradation of electrodeposited tin finishes
by: Jing Wang, et al.
Published: (2017)
by: Jing Wang, et al.
Published: (2017)
Loading…
Assessing the benefits of virtual reality training for manual assembly
by: Charlotte Temmink, et al.
Published: (2023)
by: Charlotte Temmink, et al.
Published: (2023)
Loading…
Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects
by: Canyu Liu, et al.
Published: (2021)
by: Canyu Liu, et al.
Published: (2021)
Loading…
Pulse electroplating of copper for printed circuit technology
by: Mehrdad Rezai-Kalantary
Published: (1990)
by: Mehrdad Rezai-Kalantary
Published: (1990)
Loading…
Symbiotic assembly systems – A new paradigm
by: Pedro Ferreira, et al.
Published: (2014)
by: Pedro Ferreira, et al.
Published: (2014)
Loading…
Automated freeform assembly of threaded fasteners
by: Karthick Dharmaraj
Published: (2015)
by: Karthick Dharmaraj
Published: (2015)
Loading…
Mesomechanical modelling of SnAgCu solder joints in flip chip
by: Jicheng Gong, et al.
Published: (2008)
by: Jicheng Gong, et al.
Published: (2008)
Loading…
Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder
by: Jicheng Gong, et al.
Published: (2009)
by: Jicheng Gong, et al.
Published: (2009)
Loading…
Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder
by: Guang Chen, et al.
Published: (2015)
by: Guang Chen, et al.
Published: (2015)
Loading…
Numerical analysis of lead-free solder joints: effects of thermal cycling and electromigration
by: Xu Zha
Published: (2016)
by: Xu Zha
Published: (2016)
Loading…
Investigating the role of copper in arsenic doped Cd(Se,Te) photovoltaics
by: Eric Colegrove, et al.
Published: (2022)
by: Eric Colegrove, et al.
Published: (2022)
Loading…
Board diversity and R&D investment
by: Jeanelle Midavaine, et al.
Published: (2016)
by: Jeanelle Midavaine, et al.
Published: (2016)
Loading…
Perpendicular growth characteristics of Cu-Sn intermetallic compounds at the surface of Sn99Cu1/Cu solder interconnects
by: Zhiwen Chen, et al.
Published: (2015)
by: Zhiwen Chen, et al.
Published: (2015)
Loading…
Heavy deposition: chemical and electro-deposition of copper : nickel and chromium for engineering applications: a guide for electro-depositors and for engineers / by J. David Greenwood.
by: Greenwood, J. David
Published: (1970)
by: Greenwood, J. David
Published: (1970)
Loading…
Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: physical properties, solderability and microstructural evolution under isothermal ageing
by: Guang Chen, et al.
Published: (2016)
by: Guang Chen, et al.
Published: (2016)
Loading…
Oxygen plasma cleaning of copper for photocathode applications: A MEIS and XPS study
by: TCQ Noakes, et al.
Published: (2022)
by: TCQ Noakes, et al.
Published: (2022)
Loading…
Egyptian corals-based calcium silicate (CaS) nanopowders doped with zinc/copper for improved chemical stability and treatment of calvarial defects
by: Mostafa Mabrouk, et al.
Published: (2022)
by: Mostafa Mabrouk, et al.
Published: (2022)
Loading…
Assembly-based STDP: a new learning rule for spiking neural networks inspired by biological assemblies
by: Vahid Saranirad, et al.
Published: (2022)
by: Vahid Saranirad, et al.
Published: (2022)
Loading…
Power cycling of flip chip assemblies
by: Andrew R. Ochana
Published: (2004)
by: Andrew R. Ochana
Published: (2004)
Loading…
Transistor circuit theory and design / John Franklin Pierce.
by: Pierce, John Franklin
Published: (1963)
by: Pierce, John Franklin
Published: (1963)
Similar Items
-
The role of self-assembled monolayers in the surface modification and interfacial contact of copper fillers in electrically conductive adhesives
by: Shanda Wang, et al.
Published: (2023) -
Automated adaptive control of the reflow soldering of electronic assemblies
by: Paul Conway, et al.
Published: (1997) -
Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging
by: Canyu Liu, et al.
Published: (2021) -
Dry and wet nano-scale impact dynamics of rough surfaces with or without a self-assembled monolayer
by: M. Teodorescu, et al.
Published: (2007) -
Electrical conduction stability of copper-filled adhesives in high-moisture environments
by: Shanda Wang
Published: (2020)