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Creep damage study at powercycling of lead-free surface mount device
Soldering is extensively used to assemble electronic components to printed circuit boards or chips to a substrate in microelectronic devices. These solder joints serve as mechanical, thermal and electrical interconnections, therefore, their integrity is a key reliability concern. However, newly intr...
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| Format: | Default Article |
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2009
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| Online Access: | https://hdl.handle.net/2134/4568 |
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| _version_ | 1818175504870539264 |
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| author | Pradeep Hegde David Whalley Vadim Silberschmidt |
| author_facet | Pradeep Hegde David Whalley Vadim Silberschmidt |
| author_sort | Pradeep Hegde (7202369) |
| collection | Figshare |
| description | Soldering is extensively used to assemble electronic components to printed circuit boards or chips to a substrate in microelectronic devices. These solder joints serve as mechanical, thermal and electrical interconnections, therefore, their integrity is a key reliability concern. However, newly introduced lead-free solders do not have a long history of applications in the industry and there is a lack of established material models of their behaviour over the wide temperature range experienced by electronics systems. Therefore, an extensive reliability study is required before introducing a new lead-free solder material in the electronic industries. Moreover, most of the solder materials have low melting temperatures, and are prone to creep in service. The cyclic temperature operating condition (powercycling) of the solder joint can result in the creep fatigue failure. Thus, a computational technique is used to investigate creep damage in solder joints. The present paper deals with creep damage of leadfree solder joints for powercycling using finite element analysis with the consideration of experimentally observed non-uniform temperature distributions in the 1206 surface mount chip resistor. In addition, a comparison is made for inelastic strain accumulation and fatigue life for creep damage study for spatially uniform and non-uniform temperature powercycling. |
| format | Default Article |
| id | rr-article-9562031 |
| institution | Loughborough University |
| publishDate | 2009 |
| record_format | Figshare |
| spelling | rr-article-95620312009-01-01T00:00:00Z Creep damage study at powercycling of lead-free surface mount device Pradeep Hegde (7202369) David Whalley (1248297) Vadim Silberschmidt (1248129) Mechanical engineering not elsewhere classified Condensed matter physics not elsewhere classified Powercycling Lead-free solder Creep analysis Mechanical Engineering not elsewhere classified Condensed Matter Physics Soldering is extensively used to assemble electronic components to printed circuit boards or chips to a substrate in microelectronic devices. These solder joints serve as mechanical, thermal and electrical interconnections, therefore, their integrity is a key reliability concern. However, newly introduced lead-free solders do not have a long history of applications in the industry and there is a lack of established material models of their behaviour over the wide temperature range experienced by electronics systems. Therefore, an extensive reliability study is required before introducing a new lead-free solder material in the electronic industries. Moreover, most of the solder materials have low melting temperatures, and are prone to creep in service. The cyclic temperature operating condition (powercycling) of the solder joint can result in the creep fatigue failure. Thus, a computational technique is used to investigate creep damage in solder joints. The present paper deals with creep damage of leadfree solder joints for powercycling using finite element analysis with the consideration of experimentally observed non-uniform temperature distributions in the 1206 surface mount chip resistor. In addition, a comparison is made for inelastic strain accumulation and fatigue life for creep damage study for spatially uniform and non-uniform temperature powercycling. 2009-01-01T00:00:00Z Text Journal contribution 2134/4568 https://figshare.com/articles/journal_contribution/Creep_damage_study_at_powercycling_of_lead-free_surface_mount_device/9562031 CC BY-NC-ND 4.0 |
| spellingShingle | Mechanical engineering not elsewhere classified Condensed matter physics not elsewhere classified Powercycling Lead-free solder Creep analysis Mechanical Engineering not elsewhere classified Condensed Matter Physics Pradeep Hegde David Whalley Vadim Silberschmidt Creep damage study at powercycling of lead-free surface mount device |
| title | Creep damage study at powercycling of lead-free surface mount device |
| title_full | Creep damage study at powercycling of lead-free surface mount device |
| title_fullStr | Creep damage study at powercycling of lead-free surface mount device |
| title_full_unstemmed | Creep damage study at powercycling of lead-free surface mount device |
| title_short | Creep damage study at powercycling of lead-free surface mount device |
| title_sort | creep damage study at powercycling of lead-free surface mount device |
| topic | Mechanical engineering not elsewhere classified Condensed matter physics not elsewhere classified Powercycling Lead-free solder Creep analysis Mechanical Engineering not elsewhere classified Condensed Matter Physics |
| url | https://hdl.handle.net/2134/4568 |