APA (7th ed.) Citation

Chen, G., Liu, L., Silberschmidt, V., Liu, C., Wu, F., & Chan, Y. (2018). Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient.

Chicago Style (17th ed.) Citation

Chen, Guang, Li Liu, Vadim Silberschmidt, Changqing Liu, Fengshun Wu, and Y.C Chan. Microstructural Evolution of 96.5Sn–3Ag–0.5Cu Lead Free Solder Reinforced with Nickel-coated Graphene Reinforcements Under Large Temperature Gradient. 2018.

MLA (9th ed.) Citation

Chen, Guang, et al. Microstructural Evolution of 96.5Sn–3Ag–0.5Cu Lead Free Solder Reinforced with Nickel-coated Graphene Reinforcements Under Large Temperature Gradient. 2018.

Warning: These citations may not always be 100% accurate.