Packaging of microfluidic devices for fluid interconnection using thermoplastics

A new packaging method for microfluidic devices is proposed of polymer over-molding to form a fluidic manifold integrated with the device in a single step. The anticipated advantages of the proposed method of packaging are ease of assembly and low part count, making it suitable for low cost and high...

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Bibliographic Details
Main Authors: Patrick Webb, David Hutt, Neil Hopkinson, Paul Conway, Paul Palmer
Format: Default Article
Published: 2009
Subjects:
Mechanical engineering not elsewhere classified
Bonding
Fluidics
Interconnections
Packaging
Mechanical Engineering not elsewhere classified
Mechanical Engineering
Online Access:https://hdl.handle.net/2134/4620
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https://hdl.handle.net/2134/4620

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