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New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990 / edit...

Surface mount technology for concurrent engineering and manufacturing / Frank Classon. by Classon, Frank

Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 / s...

Characterization of integrated circuit packaging materials / editors Thomas M. Moore and Robert G. McKenna ; managing editor Lee E. Fitzpatrick..

Thermal stress and strain in microelectronics packaging / edited by John H. Lau..

IEEE transactions on components, packaging, and manufacturing technology.

Quality conformance and qualification of microelectronic packages and interconnects / edited by Michael Pecht ... (et al.)..

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / Michael Pecht. by Pecht, Michael

Physical architecture of VLSI systems / edited by Robert J. Hannemann, Allan D. Kraus, Michael Pecht.

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Air cooling technology for electronic equipment / edited by Sung Jin Kim, Sang Woo Lee.

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Electronic packaging and interconnection handbook / Charles A. Harper, editor-in-chief.

Reliability of electronic packages and semiconductor devices. by Di Giacomo, Giulio

High temperature electronics / edited by F. Patrick McCluskey, Richard Grzybowski, Thomas Podlesak.

Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harman. by Harman, George G.

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Electronic techniques : shop practices and construction / Robert S. Villanucci, Alexander W. Avtgis, William F. Megow. by Villanucci, Robert S.

Electronic packaging : materials and their properties / Michael G. Pecht ... [et al.].

Electronic packaging of high speed circuitry / Stephen G. Konsowski, Arden R. Helland ; drawings by Darnetta Anderson and Robert L. Thing, Jr. by Konsowski, Stephen G.

Consumer electronics component handbook : how to identify, locate, and test consumer electronic components. by Davidson, Homer L.

Chip scale package (CSP) : design, materials, processes, reliability, and applications / John Lau, Shi-Wei Ricky Lee. by Lau, John H.

IEEE transactions on advanced packaging.

Plastics for electronics / edited by Martin Goosey.

The electronic packaging handbook / edited by Glenn R. Blackwell.

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Journal of electronics manufacturing.

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Hermeticity of electronic packages / by Hal Greenhouse. by Greenhouse, Hal

Fundamentals of microsystems packaging / Rao R. Tummala, editor.

Copper interconnect technology / Christoph Steinbrüche, Barry Chin. by Steinbrüchel, Christoph

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Contamination of electronic assemblies / Michael Pecht ... [et al.].

Fatigue life prediction of solder joints in electronic packages with ANSYS / by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic. by Madenci, Erdogan

Electronic physical design / by Barry M. Lunt. by Lunt, Barry M.

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IEEE transactions on advanced packaging.

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IEEE transactions on components and packaging technologies

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IEEE transactions on electronics packaging manufacturing

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Journal of electronic packaging transactions of the ASME.

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Adhesives technology for electronic applications : materials, processes, reliability / James J. Licari and Dale W. Swanson. by Licari, James J., 1930-

IEEE transactions on components, packaging, and manufacturing technology

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IEEE transactions on components, packaging, and manufacturing technology

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IEEE transactions on components, packaging, and manufacturing technology

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