Search Results - CHANGQING WANG

Author Results for CHANGQING WANG

Changqing Liu
Jing Wang
Zhaoxia Zhou
Geoffrey Wilcox
Mark Ashworth
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Roger J. Mortimer
Guang Chen
Li Liu
Behzad Ahmadi
Chenru Zhang

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  1. 1
    Effects of process parameters on bondability in thermosonic copper ball bonding

    Effects of process parameters on bondability in thermosonic copper ball bonding by Hui Xu, Changqing Liu, Vadim Silberschmidt, Honghui Wang

    Published 2008
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  2. 2
    Formation and homogenisation of Sn-Cu interconnects by self-propagated exothermic reactive bonding

    Formation and homogenisation of Sn-Cu interconnects by self-propagated exothermic reactive bonding by Wenbo Zhu, Xiaoting Wang, Changqing Liu, Zhaoxia Zhou, Fengshun Wu

    Published 2019
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  3. 3
    Electrodeposition and characterisation of novel Ni-NbOx composite coatings from glycol-based electrolytes as a diffusion barrier for high temperature electronics packaging

    Electrodeposition and characterisation of novel Ni-NbOx composite coatings from glycol-based electrolytes as a diffusion barrier for high temperature electronics packaging by Jacob Wang, Geoffrey Wilcox, Roger J. Mortimer, Changqing Liu, Mark Ashworth

    Published 2014
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  4. 4
    Diffusion barrier characteristics of Ni-NbOx composite electrodeposits for liquid In-Sn solder interconnects

    Diffusion barrier characteristics of Ni-NbOx composite electrodeposits for liquid In-Sn solder interconnects by Jing Wang, Geoffrey Wilcox, Roger J. Mortimer, Changqing Liu, Mark Ashworth

    Published 2015
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  5. 5
    Electrodeposition and characterization of nanocrystalline Ni-NbOx composite coatings from glycol-based electrolytes for high temperature electronics packaging

    Electrodeposition and characterization of nanocrystalline Ni-NbOx composite coatings from glycol-based electrolytes for high temperature electronics packaging by Jing Wang, Geoffrey Wilcox, Roger J. Mortimer, Changqing Liu, Mark Ashworth

    Published 2014
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  6. 6
    Interfacial reaction and microstructural evolution between Au-Ge solder and electroless Ni-W-P metallization in high temperature electronics interconnects

    Interfacial reaction and microstructural evolution between Au-Ge solder and electroless Ni-W-P metallization in high temperature electronics interconnects by Li Liu, Jinzi Cui, Jing Wang, Zhaoxia Zhou, R. Wayne Johnson, Changqing Liu

    Published 2017
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  7. 7
    Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging

    Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging by Jing Wang, Zhaoxia Zhou, Wen-Feng Lin, Changqing Liu, Behzad Ahmadi, Lee Empringham

    Published 2018
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  8. 8
    Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing

    Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isoth... by Jing Wang, Guang Chen, Fulong Sun, Zhaoxia Zhou, Zhi-Quan Liu, Changqing Liu

    Published 2018
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  9. 9
    An investigation into the effect of dry bake on the solderability degradation of electrodeposited tin finishes

    An investigation into the effect of dry bake on the solderability degradation of electrodeposited tin finishes by Jing Wang, Guang Chen, Henry Forbes, Katerina Christopoulos, Changqing Liu, Liangquan Sun, Panju Shang

    Published 2017
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  10. 10
    Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations

    Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations by Li Liu, Chenru Zhang, Song Du, Zhiwen Chen, Simin Li, Ziwen Chen, Qian Wang, Lingzhu Xie, Changqing Liu

    Published 2024
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