Search Results - David Whalley

Author Results for David Whalley

David Whalley
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Samjid H. Mannan
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  1. 1
    An investigation of environmental testing of surface-mounted components

    An investigation of environmental testing of surface-mounted components by David Whalley

    Published 2021
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  2. 2
    Reflow soldering process simulation: a simplified model

    Reflow soldering process simulation: a simplified model by David Whalley

    Published 2002
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  3. 3
    A simplified model of the reflow soldering process

    A simplified model of the reflow soldering process by David Whalley

    Published 2002
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  4. 4
    IGBT package design for high power aircraft electronic systems

    IGBT package design for high power aircraft electronic systems by Farhad Sarvar, David Whalley

    Published 2000
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  5. 5
    Thermal design of high power semiconductor packages for aircraft electronic systems

    Thermal design of high power semiconductor packages for aircraft electronic systems by Farhad Sarvar, David Whalley

    Published 1999
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  6. 6
    Temperature cycling of surface mounted thick film 'zero-ohm' jumpers

    Temperature cycling of surface mounted thick film 'zero-ohm' jumpers by David Whalley, D.S. Campbell

    Published 1987
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  7. 7
    Application of adhesives in MEMS and MOEMS assembly: a review

    Application of adhesives in MEMS and MOEMS assembly: a review by Farhad Sarvar, David Hutt, David Whalley

    Published 2002
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  8. 8
    Novel rework techniques for electronic assemblies

    Novel rework techniques for electronic assemblies by A.D. Stennett, David Whalley

    Published 1998
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  9. 9
    A comparison of modelling methods for electronic interconnect structures

    A comparison of modelling methods for electronic interconnect structures by Adebayo Oluyinka Ogunjimi, David Whalley, David Williams

    Published 1993
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  10. 10
    Tailoring thermal profiles for the reflow of SMD assemblies

    Tailoring thermal profiles for the reflow of SMD assemblies by A.C.T. Tang, David Whalley, David Williams

    Published 1990
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  11. 11
    Thermal stress analysis of conductive adhesive joints

    Thermal stress analysis of conductive adhesive joints by Adebayo Oluyinka Ogunjimi, David Whalley, David Williams

    Published 1993
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  12. 12
    Packaging effects on MEMS pressure sensor hysteresis

    Packaging effects on MEMS pressure sensor hysteresis by Youssef Hamid, David Hutt, David Whalley, Russell Craddock

    Published 2019
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  13. 13
    Effect of thin film interconnect inelasticity on MEMS pressure sensor hysteresis

    Effect of thin film interconnect inelasticity on MEMS pressure sensor hysteresis by Youssef Hamid, David Hutt, David Whalley, Russell Craddock

    Published 2019
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  14. 14
    Relative contributions of packaging elements to the thermal hysteresis of a MEMS pressure sensor

    Relative contributions of packaging elements to the thermal hysteresis of a MEMS pressure sensor by Youssef Hamid, David Hutt, David Whalley, Russell Craddock

    Published 2020
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  15. 15
    Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tin

    Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tin by Keming Chen, Changqing Liu, David Whalley, David Hutt

    Published 2005
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  16. 16
    Automated adaptive control of the reflow soldering of electronic assemblies

    Automated adaptive control of the reflow soldering of electronic assemblies by Paul Conway, David Whalley, M. Wilkinson, David Williams

    Published 1997
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  17. 17
    A substrateless process for sustainable manufacture of electronic assemblies

    A substrateless process for sustainable manufacture of electronic assemblies by Patrick Webb, David Hutt, David Whalley, Paul Palmer

    Published 2008
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  18. 18
    Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnection

    Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnection by Junlei Tao, David Whalley, Changqing Liu

    Published 2014
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  19. 19
    Comparison of heatsinks used for the thermal management of LEDs

    Comparison of heatsinks used for the thermal management of LEDs by James Pryde, David Whalley, Weeratunge Malalasekera

    Published 2016
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  20. 20
    A review of LED technology trends and relevant thermal management strategies

    A review of LED technology trends and relevant thermal management strategies by James Pryde, David Whalley, Weeratunge Malalasekera

    Published 2014
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  21. 21
    Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologies

    Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologies by Yan Zhang, Changqing Liu, David Whalley

    Published 2009
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  22. 22
    Observations on the implementation of LEDs for general lighting

    Observations on the implementation of LEDs for general lighting by James Pryde, David Whalley, Weeratunge Malalasekera

    Published 2016
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  23. 23
    The effect of co-planarity variation on anisotropic conductive adhesive assemblies

    The effect of co-planarity variation on anisotropic conductive adhesive assemblies by Guangbin Dou, David Whalley, Changqing Liu

    Published 2006
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  24. 24
    Creep analysis of a lead-free surface mount device

    Creep analysis of a lead-free surface mount device by Pradeep Hegde, David Whalley, Vadim Silberschmidt

    Published 2007
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  25. 25
    Thermal interface materials - a review of the state of the art

    Thermal interface materials - a review of the state of the art by Farhad Sarvar, David Whalley, Paul Conway

    Published 2006
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  26. 26
    Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles

    Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles by Guangbin Dou, David Whalley, Changqing Liu

    Published 2004
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  27. 27
    Mechanical and electrical characterisation of individual ACA conductor particles

    Mechanical and electrical characterisation of individual ACA conductor particles by Guangbin Dou, David Whalley, Changqing Liu

    Published 2006
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  28. 28
    Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints

    Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints by Pradeep Hegde, David Whalley, Vadim Silberschmidt

    Published 2008
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  29. 29
    The effect of droplet ejection frequency on inkjet-etched micro via holes

    The effect of droplet ejection frequency on inkjet-etched micro via holes by Yan Zhang, Cunjia Liu, David Whalley

    Published 2010
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  30. 30
    Deformation property measurement for single anisotropic conductive adhesive particles

    Deformation property measurement for single anisotropic conductive adhesive particles by Guangbin Dou, David Whalley, Changqing Liu

    Published 2006
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  31. 31
    Non-destructive defect detection for MEMS devices using transient thermography

    Non-destructive defect detection for MEMS devices using transient thermography by Xiaoting Wang, David Whalley, Vadim Silberschmidt

    Published 2016
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  32. 32
    The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin films

    The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin films by Yan Zhang, Changqing Liu, David Whalley

    Published 2012
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  33. 33
    Mechanical characterization of individual Ni/Au coated microsize polymer particles

    Mechanical characterization of individual Ni/Au coated microsize polymer particles by Guangbin Dou, David Whalley, Changqing Liu

    Published 2008
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  34. 34
    Creep damage study at powercycling of lead-free surface mount device

    Creep damage study at powercycling of lead-free surface mount device by Pradeep Hegde, David Whalley, Vadim Silberschmidt

    Published 2009
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  35. 35
    3D study of thermal stresses in lead-free surface mount devices

    3D study of thermal stresses in lead-free surface mount devices by Pradeep Hegde, David Whalley, Vadim Silberschmidt

    Published 2008
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  36. 36
    The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers

    The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers by Yan Zhang, Changqing Liu, David Whalley

    Published 2013
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  37. 37
    The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printing

    The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printing by Yan Zhang, Changqing Liu, David Whalley

    Published 2012
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  38. 38
    A mechanism of the penetration limit for producing holes in poly(4-vinyl phenol) films by inkjet etching

    A mechanism of the penetration limit for producing holes in poly(4-vinyl phenol) films by inkjet etching by Yan Zhang, Changqing Liu, David Whalley

    Published 2015
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  39. 39
    A process model of the infra-red reflow soldering of printed circuit board assemblies

    A process model of the infra-red reflow soldering of printed circuit board assemblies by David Whalley, Adebayo Oluyinka Ogunjimi, Paul Conway, David Williams

    Published 1991
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  40. 40
    Observations of solder paste reflow by means of electrical measurements

    Observations of solder paste reflow by means of electrical measurements by Samjid H. Mannan, David Hutt, David Whalley, Paul Conway

    Published 2000
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  41. 41
    Electrical method of monitoring percolation and abrasion of conducting spheres due to shear flow of a dense suspension in a narrow gap

    Electrical method of monitoring percolation and abrasion of conducting spheres due to shear flow of a dense suspension in a narrow gap by Samjid H. Mannan, David A. Hutt, David C. Whalley

    Published 1999
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  42. 42
    Thermal and electrical modelling of polymer cored BGA interconnects

    Thermal and electrical modelling of polymer cored BGA interconnects by David Whalley, H. Kristiansen, F. Guillen Marin

    Published 2008
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  43. 43
    Influence of etching solvent evaporation on the size of micro-via holes in PVP thin films

    Influence of etching solvent evaporation on the size of micro-via holes in PVP thin films by Yan Zhang, Changqing Liu, David C. Whalley

    Published 2012
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  44. 44
    Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects.

    Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects. by Guangbin Dou, David C. Whalley, Changqing Liu

    Published 2004
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  45. 45
    Direct measurement of moisture ingress in PV laminates

    Direct measurement of moisture ingress in PV laminates by Nikoleta Kyranaki, David Whalley, David Hutt, Ralph Gottschalg, Tom Betts

    Published 2019
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  46. 46
    Modelling of the initial stages of the anisotropic adhesive joint assembly process

    Modelling of the initial stages of the anisotropic adhesive joint assembly process by Samjid H. Mannan, David Whalley, Adebayo Oluyinka Ogunjimi, David Williams

    Published 1995
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  47. 47
    Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experiment

    Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experiment by Adebayo Oluyinka Ogunjimi, Samjid H. Mannan, David Whalley, David Williams

    Published 1996
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  48. 48
    Conduction mechanisms in anisotropic conducting adhesive assembly

    Conduction mechanisms in anisotropic conducting adhesive assembly by Chucks N. Oguibe, Samjid H. Mannan, David Whalley, David Williams

    Published 1998
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  49. 49
    Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory

    Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory by Samjid H. Mannan, David Whalley, Adebayo Oluyinka Ogunjimi, David Williams

    Published 1996
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  50. 50
    Computational modelling of the anisotropic conductive adhesive assembly process

    Computational modelling of the anisotropic conductive adhesive assembly process by David Whalley, Greg Glinsky, Chris Bailey, Johan Liu

    Published 2001
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