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Changqing Liu
Fengshun Wu
Guang Chen
Juan Du
Li Liu
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Vadim Silberschmidt
Y.C. Chan

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    Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles

    Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles by Guang Chen, Li Liu, Juan Du, Vadim Silberschmidt, Y.C. Chan, Changqing Liu, Fengshun Wu

    Published 2016
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