Search Results - Korhonen, T K~

  • Showing 1 - 6 results of 6
Refine Results
  1. 1
  2. 2
  3. 3
  4. 4
  5. 5

    Bidirectional electromigration failure by M.K. Lim, Vassilios Chouliaras, C.L. Gan, Vincent Dwyer

    Published 2013
    “…We seek here to investigate whether the Stress Evolutional Model of Korhonen et al. [1] is capable of describing the net effect of a voiding cycle.…”
    Get full text
    Default Article
  6. 6

    Modeling the electromigration failure time distribution in short copper interconnects by Vincent Dwyer

    Published 2008
    “…The electromigration EM lifetime in short copper interconnects is modeled using a previously developed means of generating realistic interconnect microstructures combined with the one-dimensional stress evolution equation of Korhonen et al. …”
    Get full text
    Default Article