Search Results - Liu, Chengjin~

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  1. 1
    Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics

    Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics by Chengjiong Tuo, Zhenhua Yao, Wei Liu, Shengfa Liu, Li Liu, Zhiwen Chen, Shangyu Huang, Changqing Liu, Xueqiang Cao

    Published 2021
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  2. 2
    High-entropy silicide ceramics developed from (TiZrNbMoW)Si2 formulation doped with aluminum

    High-entropy silicide ceramics developed from (TiZrNbMoW)Si2 formulation doped with aluminum by Yuan Qin, Jin-Cheng Wang, Ji-Xuan Liu, Xiao-Feng Wei, Fei Li, Guo-Jun Zhang, Chengxi Jing, Jiawei Zhao, Houzheng Wu

    Published 2020
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