Search Results - Liu, FengHua~
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Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder
Published 2015Get full text
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Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition
Published 2015Get full text
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Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects
Published 2017Get full text
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Heterogeneous attention based transformer for sign language translation
Published 2023Get full text
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3D multi-nozzle system with dual drives highly potential for 3D complex scaffolds with multi-biomaterials
Published 2017Get full text
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Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections
Published 2015Get full text
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Formation and homogenisation of Sn-Cu interconnects by self-propagated exothermic reactive bonding
Published 2019Get full text
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Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles
Published 2016Get full text
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Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets
Published 2016Get full text
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Ongoing drainage reorganization driven by rapid lake growths on the Tibetan Plateau
Published 2021Get full text
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The seventh blind test of crystal structure prediction: structure ranking methods
Published 2024Get full text
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