Search Results - Stencil, D*
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1
Materials and processes issues in fine pitch eutectic solder flip chip interconnection
Published 2006“…New product designs within the electronics packaging industry continue to demand interconnects at shrinking geometry, both at the integrated circuit and supporting circuit board substrate level, thereby creating numerous manufacturing challenges. …”
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2
Characterization of printed solder paste excess and bridge related defects
Published 2008“…Paradigmatic cause models, and associated design rules and effects data are extrapolated from academic and industrial literature and formulated into physical models that identify and integrate the process into three discrete solder paste deposition events - i.e. …”
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3
Hybrid microfluidic devices based on polymeric materials functionalized for cell biology applications
Published 2014“…Laser machining parameters were empirically optimized to fabricate arrays of through-holes with entrance diameter ranging from 30 μm to 150 μm and having different exit diameter (from 10 to 20 μm) on the PNIPAAm employing a stencil aluminum mask. …”
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Multifunctional vertical interconnections of multilayered flexible substrates for miniaturised POCT devices
Published 2016“…Those samples were divided into three groups for thermal cycling test, damp heat ageing test and bending test. …”
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5
Materials and processes issues in fine pitch eutectic solder flip chip interconnection
Published 2004“…New product designs within the electronics packaging industry continue to demand interconnects at microscopic geometry, both at the Integrated Circuit (IC) and supporting board level, thereby creating numerous manufacturing challenges. …”
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6
Numerical modelling of multi-material interfaces
Published 2011“…The results demonstrate the advantages of the fully multi-dimensional MPDATA remapping.…”
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7
Microwave assisted processing of metal loaded inks and pastes for electronic interconnect applications
Published 2014“…Silver (Ag)filled ICAs and inks are the most popular due to their high conductivity and good reliability. …”
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Materials issues in the transition to lead-free solder alloys and joint miniaturization
Published 2005“…In addition, one and two-dimensional combined thermodynamic and kinetic models have been developed to assist the understanding of the kinetics of interdiffusion and the formation of interfacial intermetallic compounds during reflow. …”
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