Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging by Canyu Liu, Allan Liu, Yutai Su, Zhaoxia Zhou, Changqing Liu

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Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects by Canyu Liu, Allan Liu, Yutai Su, Yi Chen, Zhaoxia Zhou, Changqing Liu

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Statistical effects of pore features on mechanical properties and fracture behaviors of heterogeneous random porous materials by phase-field modeling by Yutai Su, Jiaqi Zhu, Xu Long, Liguo Zhao, Chuantong Chen, Changqing Liu

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Coupling of phase field and viscoplasticity for modelling cyclic softening and crack growth under fatigue by Jianan Song, Liguo Zhao, H Qi, S Li, D Shi, J Huang, Yutai Su, Kun Zhang

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Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores by Yutai Su, Guicui Fu, Changqing Liu, Kun Zhang, Liguo Zhao, Canyu Liu, Allan Liu, Jianan Song

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Discussion on the microscale geometry as the dominant factor for strength anisotropy in material extrusion additive manufacturing by James Allum, Amirpasha Moetazedian, Andy Gleadall, Vadim Silberschmidt

“…This paper presents a discussion and interpretation of the findings in the review paper “Fused filament fabrication of polymer materials: A review of interlayer bond” by Xia Gao, Shunxin Qi, Xiao Kuang, Yunlan Su, Jing Li, Dujin Wang [Additive Manufacturing (2020): 101658]. …”
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