Search Results - Whalley, H.

Author Results for Whalley, H.

David Whalley
Samjid H. Mannan
David Hutt
Changqing Liu
Paul Conway
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David Williams
Jianfeng Li
Adebayo Oluyinka Ogunjimi
H. Kristiansen
Keming Chen

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  1. 1
    Thermal and electrical modelling of polymer cored BGA interconnects

    Thermal and electrical modelling of polymer cored BGA interconnects by David Whalley, H. Kristiansen, F. Guillen Marin

    Published 2008
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  2. 2
    Observations of solder paste reflow by means of electrical measurements

    Observations of solder paste reflow by means of electrical measurements by Samjid H. Mannan, David Hutt, David Whalley, Paul Conway

    Published 2000
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  3. 3
    Electrical method of monitoring percolation and abrasion of conducting spheres due to shear flow of a dense suspension in a narrow gap

    Electrical method of monitoring percolation and abrasion of conducting spheres due to shear flow of a dense suspension in a narrow gap by Samjid H. Mannan, David A. Hutt, David C. Whalley

    Published 1999
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  4. 4
    Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections

    Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections by Junlei Tao, David Whalley, Changqing Liu, Fengshun Wu, H. Kristiansen

    Published 2015
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  5. 5
    Modelling of the initial stages of the anisotropic adhesive joint assembly process

    Modelling of the initial stages of the anisotropic adhesive joint assembly process by Samjid H. Mannan, David Whalley, Adebayo Oluyinka Ogunjimi, David Williams

    Published 1995
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  6. 6
    Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experiment

    Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experiment by Adebayo Oluyinka Ogunjimi, Samjid H. Mannan, David Whalley, David Williams

    Published 1996
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  7. 7
    Conduction mechanisms in anisotropic conducting adhesive assembly

    Conduction mechanisms in anisotropic conducting adhesive assembly by Chucks N. Oguibe, Samjid H. Mannan, David Whalley, David Williams

    Published 1998
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  8. 8
    Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory

    Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory by Samjid H. Mannan, David Whalley, Adebayo Oluyinka Ogunjimi, David Williams

    Published 1996
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  9. 9
    Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activation

    Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activation by David Hutt, Changqing Liu, Paul Conway, David Whalley, Samjid H. Mannan

    Published 2002
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  10. 10
    Under bump metallisation of fine pitch flip-chip using electroless nickel deposition

    Under bump metallisation of fine pitch flip-chip using electroless nickel deposition by Changqing Liu, David Hutt, David Whalley, Paul Conway, Samjid H. Mannan

    Published 2000
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  11. 11
    Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel plating

    Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel plating by David Hutt, Changqing Liu, Paul Conway, David Whalley, Samjid H. Mannan

    Published 2002
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  12. 12
    Investigation of a solder bumping technique for flip-chip interconnection

    Investigation of a solder bumping technique for flip-chip interconnection by David Hutt, Daniel G. Rhodes, Paul Conway, Samjid H. Mannan, David Whalley

    Published 1999
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  13. 13
    Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnects

    Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnects by Keming Chen, Changqing Liu, David Whalley, David Hutt, Jianfeng Li, Samjid H. Mannan

    Published 2006
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  14. 14
    The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrate

    The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrate by Katrin Gustafsson, Samjid H. Mannan, Zonghe Lai, Johan Liu, David Whalley, David Williams

    Published 1997
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  15. 15
    Solder paste reflow modeling for flip chip assembly

    Solder paste reflow modeling for flip chip assembly by Samjid H. Mannan, D. Wheeler, David Hutt, David Whalley, Paul Conway, Chris Bailey

    Published 2000
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  16. 16
    A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tin

    A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tin by Keming Chen, Changqing Liu, David Whalley, David Hutt, Jianfeng Li, Samjid H. Mannan

    Published 2008
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  17. 17
    Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications

    Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications by Jianfeng Li, Samjid H. Mannan, Mike P. Clode, H.M. Lobato, Changqing Liu, David Whalley, F.T. Lawrence, G. Jackson, H. Steen

    Published 2005
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  18. 18
    Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb system

    Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb system by Jianfeng Li, Farhad Sarvar, David Whalley, David Hutt, Mike P. Clode, Samjid H. Mannan

    Published 2007
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  19. 19
    Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheres

    Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheres by Shiwani Jain, David Whalley, Michael C.W. Cottrill, H. Kristiansen, K. Redford, C.B. Nilsen, T. Helland, Changqing Liu

    Published 2011
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  20. 20
    Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnects

    Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnects by Jianfeng Li, Samjid H. Mannan, Mike P. Clode, Keming Chen, David C. Whalley, David A. Hutt, Paul Conway

    Published 2008
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