Search Results - Wu, Zhangping~
-
1
-
2
Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition
Published 2015Get full text
Default Article -
3
Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging
Published 2015Get full text
Default Article -
4
-
5
-
6
Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder
Published 2015Get full text
Default Article -
7
Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections
Published 2015Get full text
Default Conference proceeding -
8
-
9
Formation and homogenisation of Sn-Cu interconnects by self-propagated exothermic reactive bonding
Published 2019Get full text
Default Article -
10
-
11
Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets
Published 2016Get full text
Default Article -
12
-
13
Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects
Published 2017Get full text
Default Article -
14
-
15
-
16
-
17
Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles
Published 2016Get full text
Default Article -
18
-
19
The mechanism of adapting RED parameters to TCP traffic
Published 2009Get full text
Default Article -
20
An algorithm for adapting RED parameters to TCP traffic
Published 2008Get full text
Default Conference proceeding -
21
-
22
-
23
-
24
Optimization of ultrasound information imaging algorithm in cardiovascular disease based on image enhancement
Published 2021Get full text
Default Article -
25
-
26
-
27
-
28
Gait motion analysis based on WB-4 sensor with quaternion algorithm
Published 2016Get full text
Default Conference proceeding -
29