Effects of stress and electromigration on microstructural evolution in microbumps of three-dimensional integrated circuits by Hua Xiong, Zhiheng Huang, Paul Conway

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Multiscale microstructures and microstructural effects on the reliability of microbumps in three-dimensional integration by Zhiheng Huang, Hua Xiong, Zhiyong Wu, Paul Conway, Frank Altmann

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A fully coupled hydrodynamic-DEM model for simulating debris dynamics and impact forces by Yan Xiong, Qiuhua Liang, Jinhai Zheng, Jacob Stolle, Ioan Nistor, Gang Wang

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Microstructure-based multiphysics modeling for semiconductor integration and packaging by Zhiheng Huang, Hua Xiong, Zhiyong Wu, Paul Conway, Hugh Davies, Alan Dinsdale, Yunfei En, Qingfeng Zeng

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Electrospinning-assisted construction of rapid proton conduction channels in halloysite nanotube-encapsulated ionic liquid-embedded sulfonated poly(ether ether ketone) proton excha... by C Xiong, Z Ling, B Wang, Y Yu, Q Liu, X Fu, C Wu, R Zhang, S Hu, Xujin Bao, J Yang

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