IMC and the practitioners’ strategy paradox by Argyro Elisavet Manoli, Mark Davies

“…This study aims at providing an alternative viewpoint to what IMC entails, using academics’ and practitioners’ views, while examining both the theoretical appreciation of IMC and its practical implementation. …”
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The implementation of integrated marketing communication (IMC): evidence from professional football clubs in England by Argyro Elisavet Manoli, Ian Hodgkinson

Subjects: “…IMC scenarios…”
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Internal Model Control (IMC) design for a stall-regulated variable-speed wind turbine system by Norzanah Rosmin

Subjects: “…IMC…”
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Perpendicular growth characteristics of Cu-Sn intermetallic compounds at the surface of Sn99Cu1/Cu solder interconnects by Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An

Subjects: “…Planar growth of IMCs…”
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Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite by Han Jiang, Stuart Robertson, Shuibao Liang, Zhaoxia Zhou, Liguo Zhao, Changqing Liu

Subjects: “…IMC growth kinetics…”
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Micro-mechanical characteristics and dimensional change of Cu-Sn interconnects due to growth of interfacial intermetallic compounds by Zhiwen Chen

Subjects: “…Growth of IMCs…”
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Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: physical properties, solderability and microstructural evolution under isothermal ageing by Guang Chen, Hao Peng, Vadim Silberschmidt, Y.C. Chan, Changqing Liu, Fengshun Wu

Subjects: “…Interfacial IMC…”
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Deposition and application of electroless Ni–W–P under bump metallisation for high temperature lead-free solder interconnects by Li Liu

Subjects: “…IMCs…”
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Some dimensions of integration between packaging and magazine advertising by Ying-Leng Chiew

“…Integrated Marketing Communications (IMC) has been recognised as an important concept in today's marketing. …”
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Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications by Jianfeng Li, Samjid H. Mannan, Mike P. Clode, H.M. Lobato, Changqing Liu, David Whalley, F.T. Lawrence, G. Jackson, H. Steen

“…However, given that IMC growth is generally much faster when the solder is liquid, the growing IMC must act as a strong diffusion barrier to suppress further IMC growth. …”
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Integrated marketing communications in football by Argyro Elisavet Manoli

“…This book takes an important step forward in showing how Integrated Marketing Communications (IMC) have been applied within the English Premier League (EPL) – arguably the most commercialised and watched sport league in the world – and how it can and should be utilised in the context of other sports properties.  …”
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Integration scenarios in football by Argyro Elisavet Manoli

“…This study aims at acquiring a more holistic view of IMC’s practical implementation, by studying a full industry sector of client organisations (the football industry), and examining whether and to what extent IMC is implemented. …”
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Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects by Canyu Liu, Allan Liu, Yutai Su, Yi Chen, Zhaoxia Zhou, Changqing Liu

“…For the U-TLPS of Zn-5Al onto Ni substrate, three IMC layers, Ni5Zn21, NiAl and Ni5Zn21 IMC were also observed, with the porous Ni5Zn21 IMC layers present in adjacent to the Ni substrate. …”
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Integration scenarios by Argyro Elisavet Manoli

“…With a focus on exploring IMC’s implementation and appreciation in EPL clubs, and thus offering a wider and more thorough view of IMC in practice, this chapter centres on synthesising football clubs’ practices and practitioners’ views. …”
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The electrodeposition of tin coatings from deep eutectic solvents and their subsequent whisker growth by Christopher Stuttle

“…This technique was used throughout this project for the study of IMC growth from tin electrodeposits as it was able to effectively remove the tin whilst leaving the IMCs and substrate unaffected. …”
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Thermosonic ball bonding: a study of bonding mechanism and interfacial evolution by Hui Xu

“…The IMCs are formed preferentially in the peripheral and the central areas of the bonds during bonding and, moreover, they grow from the initially formed IMC particles. …”
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Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isoth... by Jing Wang, Guang Chen, Fulong Sun, Zhaoxia Zhou, Zhi-Quan Liu, Changqing Liu

“…Unlike a commonly held belief that the initial wettability loss is due to surface-exposing and oxidation of IMCs, it was found from dual combined effects of inward surface oxidation and outward IMC growth.…”
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An investigation into nano-particulates reinforced SAC305-based composite solders under electro- and thermo-migration conditions by Guang Chen

“…For the composite solders, both anode and cathode showed a continuous growth of interfacial IMCs; the growth rates of IMCs at the anode were greater than that at cathode. …”
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An investigation into the effect of dry bake on the solderability degradation of electrodeposited tin finishes by Jing Wang, Guang Chen, Henry Forbes, Katerina Christopoulos, Changqing Liu, Liangquan Sun, Panju Shang

“…The solderability of component termination finishes degrades upon storage due to the combined effects of surface contamination, oxidation, corrosion and/or intermetallic compound (IMC) formation at the interface between substrate and finishes. …”
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Hydro-biogeochemical coupling beneath a large polythermal Arctic glacier: implications for subice sheet biogeochemistry by Jemma Wadham, Martyn Tranter, A.J. Hodson, Richard Hodgkins, S. Bottrell, Richard Cooper, R. Raiswell

“…We analyze the interannual chemical and isotopic composition of runoff from a large, high Arctic valley glacier over a 5 year period, during which drainage evolved from a long-residence-time drainage system feeding an artesian subglacial upwelling (SGU) at the glacier terminus to a shorter-residence-time drainage system feeding an ice-marginal channel (IMC). Increased icemelt inputs to the SGU are thought to have triggered this evolution. …”
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Properties and behaviour of Pb-free solders in flip-chip scale solder interconnections by Dezhi Li

“…In order to garner more understanding of lead-free solders and their application in flip-chip scale packages, the properties of lead free solders, including the wettability, intermetallic compound (IMC) growth and distribution, mechanical properties, reliability and corrosion resistance, were studied and are presented in this thesis. …”
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Gallium-based transient liquid phase bonding for Cu-Cu electronic interconnections by Yi Chen

“…This initial investigation on IMC formations encompasses a detailed analysis of the kinetics of IMC grain growth and the affecting factors, linking to their microstructural and morphological evolution. …”
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Electrodeposition and characterisation of novel Ni-NbOx composite coatings from glycol-based electrolytes as a diffusion barrier for high temperature electronics packaging by Jacob Wang, Geoffrey Wilcox, Roger J. Mortimer, Changqing Liu, Mark Ashworth

“…Conventional solder interconnects that have been extensively utilised in consumer electronics are no longer adequate primarily due to excessive intermetallic compounds (IMCs) that can be formed and continuously grow during high temperature operation. …”
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Delivering sustainable water supply in fragile and conflict affected states: experiences from Syria by Niall L. Boot, Y. Chen, S. Cohen, W. Khayat, Andre Steele

“…This paper shares a background on rehabilitation works to date, but focuses predominantly on recent cost recovery consultancy work from IMC Worldwide. Key lessons revolve around the ability to complete such complex work under remote work arrangements, developing suitable tariffs with uncertain information and how to best develop customer complaints mechanisms.…”
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Materials issues in the transition to lead-free solder alloys and joint miniaturization by Zhiheng Huang

“…The resultant bulk and interfacial microstructures from a variety of pad sizes, ranging from 1 mm down to 25 µm, suggest that in general the small bumps contain smaller β-Sn dendrites and Ag₃Sn IMC particles, nevertheless the interfacial IMC is thicker in the smalI bumps than in the large bumps. …”
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Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing by Zhiwen Chen, Changqing Liu, Bing An, Yiping Wu, Li Liu

“…Evolution of mechanical properties of IMCs can be attributed to constrained volume shrinkage induced by solidstate reactions that producing IMCs. …”
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Numerical analysis of lead-free solder joints: effects of thermal cycling and electromigration by Xu Zha

“…This thesis presents an investigation, which is based on finite-element method, into the performance of lead-free solder interconnects under thermal fatigue and electro-migration, specifically in the areas as follows: (1) the investigation of thermal-mechanical performance and fatigue-life prediction of flip-chip package under different sizes to achieve a further understanding of IMC layer and size effects of a flip chip package under thermal cycling; (2) the establishment of a numerical method, simulating void-formation/crack-propagation based on the results of finite-element analysis, to allow the prediction of crack evolution and failure time for electro-migration reliability of solder bumps; (3) the establishment of a flow-based algorithm for combination effects of thermal-mechanical and electro-migration that was subsequent implemented in to an FE model to evaluate the reliability assessment of service lives associated with a flip chip package.…”
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Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition by Liping Mo, Zhichao Chen, Fengshun Wu, Changqing Liu

“…From the microstructural observation by electron backscatter diffraction (EBSD), a mixture of IMCs phases (Cu6Sn5 and Cu3Sn) has been found to constitute the sandwich-structured Cu/IMCs/Cu joints. …”
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Advanced electronic interconnections based on template-assisted electrodeposited Cu nanowire/micropillar arrays by Han Jiang

“…Moreover, the intermetallic compound (IMC) joints formed with this interlayer possesses refined equiaxed Cu6Sn5 grains which exhibits ~29.1% higher bonding strength than the joints bonded with Sn interlayer of the same thickness and bonding conditions. …”
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Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer by Han Jiang, Stuart Robertson, Shuibao Liang, Zhaoxia Zhou, Liguo Zhao, Changqing Liu

“…As a result, the shear strength of IMC joints achieved with Cu-Sn NI was found to be higher than those bonded with Sn interlayer. …”
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Effect of thermal aging on interfacial behaviour of copper ball bonds by Hui Xu, Changqing Liu, Vadim Silberschmidt

“…The proper IMCs formation is beneficial to bonding strength but an excessive growth of IMCs, voids and cracks can induce a mechanical failure and increase a contact resistance. …”
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Transient liquid phase bonding with Ga-based alloys for electronics interconnections by Yi Chen, Canyu Liu, Zhaoxia Zhou, Changqing Liu

“…The constituent of the resultant joints consists of θ − CuGa2 and γ3 − Cu9Ga4 IMC phases as identified, which are formed as the results of interfacial reactions between liquid Ga-based alloys and Cu substrate. …”
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Interfacial reaction and microstructural evolution between Au-Ge solder and electroless Ni-W-P metallization in high temperature electronics interconnects by Li Liu, Jinzi Cui, Jing Wang, Zhaoxia Zhou, R. Wayne Johnson, Changqing Liu

“…The elevated working temperature of high temperature electronics can inevitably cause potential excessive growth of interfacial intermetallic compounds (IMCs), which can significantly deteriorate the mechanical integrity of electronic devices. …”
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Diffusion barrier characteristics of Ni-NbOx composite electrodeposits for liquid In-Sn solder interconnects by Jing Wang, Geoffrey Wilcox, Roger J. Mortimer, Changqing Liu, Mark Ashworth

“…This is primarily due to excessive intermetallic compounds (IMCs) that can form and continuously grow during high temperature operation, which renders conventional barrier metallizations inadequate. …”
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Development of a toolkit for component-based automation systems by Charles S. McLeod

“…The research presented in this thesis is built upon the work from COMPAG/COMPANION (COMponent- based Paradigm for AGile automation, and COmmon Model for PArtNers in automatION), and as part of the BDA (Business Driven Automation), SOCRADES (Service Oriented Cross-layer infrastructure for Distributed smart Embedded deviceS), and IMC-AESOP (ArchitecturE for Service- Oriented Process – monitoring and control) projects conducted at Loughborough University UK. …”
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Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects by Li Liu, Zhiwen Chen, Zhaoxia Zhou, Guang Chen, Fengshun Wu, Changqing Liu

“…The operating temperature of high-temperature electronics can significantly promote the growth of intermetallic compounds (IMCs) at solder/substrate interfaces, particularly for low-cost Zn-based solders because of the rapid rate of reaction of Zn with Cu. …”
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Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets by Guang Chen, Fengshun Wu, Changqing Liu, Vadim Silberschmidt, Y.C. Chan

“…Additionally, blocky Ni-Sn-Cu IMC/GNS hybrids were also observed homogenously distributed in the composite solder matrices. …”
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Microstructural and mechanical characteristics of micro-scale intermetallic compounds interconnections by Liping Mo

“…Thereby, systematic studies have been conducted to study the microstructural evolution and reliability issues of Cu-Sn and Cu-Sn-Ni IMCs micro-joints. (1) Phenomenon of IMCs planar growth: The planar IMCs interlayer was asymmetric and composed of (Cu,Ni)6Sn5 mainly in Ni/Sn (2.5~5 µm)/Cu interconnect. …”
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Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt

“…The results show that Cu6Sn5 IMCs are formed first in a grain; then large Sn dendrites; fibre-like Ag3Sn IMCs are formed ahead of the β-Sn matrix in the coupling process generating eutectics.…”
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Interfacial intermetallic compounds growth kinetics and mechanical characteristics of Ga-Cu interconnects prepared via transient liquid phase bonding by Yi Chen, Han Jiang, Zhaoxia Zhou, Changqing Liu

“…The Cu9Ga4 phase were observed and the growth rate of Ga-Cu IMCs has been investigated. The research findings indicate that the growth mechanism of interface IMCs is primarily diffusion-controlled, with CuGa2 grains exhibiting anisotropic growth. …”
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Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test by Liping Mo, Chaowei Guo, Zheng Zhou, Fengshun Wu, Changqing Liu

“…This study focuses on the microstructural evolution process of Cu–Sn–Ni intermetallic compounds (IMCs) interlayer in the micro-joints, formed from the initial Ni/Sn (1.5 µm)/Cu structure through transient liquid phase (TLP) soldering. …”
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Microstructural features and mechanical behaviour of lead free solders for microelectronic packaging by Jicheng Gong

“…Formation of phases and IMCs with the body of a liquid SnAgCu solder during solidification The formation behaviour of basic components for a SnAgCu grain (including Sn dendrites, AIDSn and Cu6Sns IMCs) during solidification was investigated. …”
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Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient by Guang Chen, Li Liu, Vadim Silberschmidt, Changqing Liu, Fengshun Wu, Y.C. Chan

“…The interfacial intermetallic compounds (IMCs) present in the composite solder joint also provide a more stable morphology after the TM test for 600 h. …”
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