The Micro‐Nano Hybrid Filler Al 2 O 3 @ CuNPs Is Used to Improve the Thermal Conductivity of Epoxy Resin Composites

In this study, a micro/nano hybrid filler comprised of Al 2 O 3 @CuNPs is synthesized through a chemical reduction method. The incorporation of Cu nanoparticles serves as a bridge, addressing the contact issues within the filler and substantially enhancing its ability to establish a thermal conducti...

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Bibliographic Details
Published in:Journal of polymer science (2020) 2026-02
Main Authors: Lu, Zijian, Wu, Wei, Drummer, Dietmar, Rösel, Uta, Tomiak, Florian, Wang, Yi, Liu, Chao, Li, Shuo, Zhao, Xintong
Format: Article
Language:English
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