Voltammetric response of a copper(II) complex incorporated in silica-modified carbon-paste electrode

This work describes the preparation, characterization and use of the complex formed by Cu(II) with 3-aminopropyltriethoxysilane immobilized on silica gel, incorporated into a carbon-paste electrode. The electrochemical studies were carried out in deaerated, 0.1 mol l −1 KCl solution through cyclic v...

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Bibliographic Details
Published in:Analytica chimica acta 1999-04, Vol.385 (1), p.103-109
Main Authors: Borgo, C.A, Ferrari, R.T, Colpini, L.M.S, Costa, C.M.M, Baesso, M.L, Bento, A.C
Format: Article
Language:English
Subjects:
Analytical chemistry
Carbon-paste electrode
Chemistry
Copper
Electrochemical methods
Electrochemistry
Exact sciences and technology
General and physical chemistry
Kinetics and mechanism of reactions
Silica gel
Voltammetry
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Summary:This work describes the preparation, characterization and use of the complex formed by Cu(II) with 3-aminopropyltriethoxysilane immobilized on silica gel, incorporated into a carbon-paste electrode. The electrochemical studies were carried out in deaerated, 0.1 mol l −1 KCl solution through cyclic voltammetry by scanning the potential from +1.0 to −1.0 V. Two redox processes were observed that could be assigned to Cu(II)/Cu(I). The formal standard potentials, E 0′ (where E 0′=( E pa+ E pc)/2; E pa the anodic and E pc the cathodic peak potentials), of the first and second redox couples were calculated, giving 94 and −274 mV vs. Ag/AgCl, respectively. The dependence of peak potential on the sweeping rate, indicated a quasi-reversible behavior. From the plot of I p vs. v 1/2 ( I p is the peak current and v the scan rate), a straight line was obtained at low scan rates (
ISSN:0003-2670
1873-4324
DOI:10.1016/S0003-2670(98)00773-9