Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction

•Inclusion of paraffin wax reduces the base temperature of heat sink.•An enhancement ratio of 2.64 at ψ=1.00 is achieved for a SPT of 60°C at 3.174kW/m2 for 2mm thick pin-fin heat sink.•At heat input of 1.98kW/m2, it took 145min and 229min to reach SPTs of 60°C and 70°C respectively.•3mm Pin-fin thi...

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Bibliographic Details
Published in:Applied thermal engineering 2017-02, Vol.112, p.143-155
Main Authors: Arshad, Adeel, Ali, Hafiz Muhammad, Ali, Muzaffar, Manzoor, Shehryar
Format: Article
Language:English
Subjects:
Aluminum
Concentration (composition)
Cooling
Cross-sections
Electronic devices
Fins
Heat conductivity
Heat flux
Heat sink
Heat sinks
Heat transfer
Latent heat
Paraffin wax
Performance evaluation
Phase change materials
Phase change materials (PCMs)
Reliability
Studies
Thermal conductivity
Thermal conductivity enhancer (TCE)
Thermal energy
Thermal management (TM)
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