Interface phonon scattering suppression boosts heat conduction in thermal interface materials

•Orientation and graphene surface modification of carbon fibers were achieve by a scalable strategy.•The obtained composites achieve excellent through-plane thermal conductivity at low filler loadings.•The enhanced thermal conductivity is attributed to that graphene coating suppresses interface phon...

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Bibliographic Details
Published in:Chemical engineering journal (Lausanne, Switzerland : 1996) Switzerland : 1996), 2024-11, Vol.500, p.156924, Article 156924
Main Authors: Chen, Zhiqiang, Yu, Cuiqian, Ge, Ying, Ou, Kaiqin, Chen, Jie, Lu, Hongbin
Format: Article
Language:English
Subjects:
Carbon fibers
Graphene
Phonon scattering
Thermal interface materials
Thermal management
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Summary:•Orientation and graphene surface modification of carbon fibers were achieve by a scalable strategy.•The obtained composites achieve excellent through-plane thermal conductivity at low filler loadings.•The enhanced thermal conductivity is attributed to that graphene coating suppresses interface phonon scattering.•Composites exhibit outstanding cooling capability and long-term thermal stability. The increasing power density and integration of electronic devices bring new challenges for thermal interface materials (TIMs), a critical component to achieve heat dissipation. Constructing a continuous heat transfer framework is able to improve the thermal performance of TIMs. However, phonon scattering at the filler-resin interface always results in limited heat transfer efficiency and low thermal conductivities. We report a phonon-matched interface modification strategy that can significantly suppress the phonon scattering in carbon fiber (CF)-resin TIMs. The graphene layer was uniformly assembled on CF surface to construct the anti-leakage interface by a scalable coating-rolling process. Such phonon-matched interfaces prolong the lifetime of flexural phonons and boost the axial heat conduction of CFs. The TIMs exhibit a record through-plane thermal conductivity of 131.1 W m−1 K−1 and a per-unit volume enhancement efficiency (TCEE) of 6359%, along with superior heat dissipation efficiency and long-term stability, showing industrial potential that exploiting interface phonon suppression to largely enhance the heat conduction efficiency.
ISSN:1385-8947
DOI:10.1016/j.cej.2024.156924