An additively manufactured manifold-microchannel heat sink for high-heat flux cooling

• Published in: International journal of mechanical sciences 2023-06, Vol.248, p.108228, Article 108228
• Main Authors: Kong, Daeyoung, Jung, Euibeen, Kim, Yunseo, Manepalli, Vivek Vardhan, Rah, Kyupaeck Jeff, Kim, Han Sang, Hong, Yongtaek, Choi, Hyoung Gil, Agonafer, Damena, Lee, Hyoungsoon
• Format: Article
• Language: English
• Subjects: Additive manufacturing; Electronics cooling; Laser powder bed fusion; Manifold microchannel; Thermal management
• ISSN: 0020-7403; 1879-2162
• DOI: 10.1016/j.ijmecsci.2023.108228

•Manifold microchannel heat sink (MMCHS) for high-heat flux cooling is fabricated monolithically via laser powder bed fusion (LPBF) process using AlSi10Mg.•Experiments on the single-phase cooling of MMCHS are undertaken in the range of mass flow rate of 100–400 g/min and heat flux of 0–240 W/cm2, after which the streamlines and distribution of channel velocity are numerically-analyzed.•As a result of integrating the manifold layer, the experimental results suggest a total thermal resistance as low as 0.21 K/W with an incredibly low-pressure drop of 1.7 kPa and equivalent pumping power of 11.4 mW.•Compared to a traditional microchannel heat sink, the reported MMCHS reduces thermal resistance and pressure drop by up to 44 and 70%, respectively. Active liquid cooling technique with great efficiency not only reduces power consumption but also effectively dissipates high heat flux. In this study, a manifold-microchannel heat sink (MMCHS) was monolithically fabricated by additive manufacturing, and the thermal and hydraulic performance was investigated in a closed loop. Utilizing AlSi10Mg powder, the laser powder bed fusion process was used to fabricate the complex heat sink structure by directly putting a 3D liquid routing manifold structure on a typical microchannel. The MMCHS, with an overall size of 30 × 15 × 9 mm3, can support a heated area of 10 × 10 mm2 and features a tapered structure to facilitate uniform coolant flow. This system contains microchannels with a width and height of 0.2 mm and 2 mm, respectively, with an aspect ratio of AR = 21. Our results show that the MMCHS can dissipate effective heat flux up to 240 W/cm2 with a mass flow rate of 395 g/min with a considerably low-pressure drop of 1.7 kPa and low heated surface temperature of 100 °C. The corresponding total thermal resistance is as low as 0.21 K/W. In addition, numerical simulations showed detailed flow information as well as good agreement with experimental data. Finally, methods for structural improvement of the manifold microchannel were suggested based on the experimental and numerical results. [Display omitted]