Influence of asymmetric rolling paths on the microstructure, texture, mechanical behavior, and electrical conductivity of electrolytic tough-pitch copper

• Published in: Materials chemistry and physics 2025-02, Vol.332, p.130246, Article 130246
• Main Authors: Solouki, Hanieh, Jamaati, Roohollah, Aval, Hamed Jamshidi
• Format: Article
• Language: English
• Subjects: Asymmetric rolling path; Electrolytic tough-pitch copper; Mechanical properties; Microstructural evolution; Simulation; Texture
• ISSN: 0254-0584
• DOI: 10.1016/j.matchemphys.2024.130246

In this work, the influence of asymmetric rolling paths on the microstructure, texture, mechanical behavior, and electrical conductivity of electrolytic tough-pitch copper was studied. Four different asymmetric rolling paths including unidirectional (UD), rolling (RD), transverse (TD), and normal (ND) with a thickness reduction of 90 % were applied. Based on simulation results, the uniformity of strain distribution in the UD path was less than the other paths, the RD and ND paths had a better distribution of strain along the thickness, and the TD path exhibited the best strain distribution. Because of this, the TD, ND, and RD samples revealed a better distribution of copper oxide particles compared to the UD sample. The homogeneity of texture through the sheet thickness for the RD, TD, and ND paths was more than that for the UD path due to the uniform strain distribution. Unlike the other samples, the UD sample exhibited {001}⟨110⟩ Rotated Cube and {001}⟨100⟩ Cube orientations in the areas close to the surface due to the formation of severe accumulated strain. The maximum yield strength (405.5 MPa) and tensile strength (419.0 MPa) belonged to the RD sample. The TD sample showed a lower strain hardening rate as a result of easier cross-slip. The highest electrical conductivity (85.2 %IACS) belonged to the TD sample due to its lower dislocation density. The presence of θ-fiber and γ-fiber improved the electron conductivity of copper. •The UD path decreased the uniformity of strain distribution, texture, and hardness.•The maximum ultimate tensile strength (419.0 MPa) belonged to the RD sample.•TD sample showed a lower strain hardening rate as a result of easier cross-slip.•The highest electrical conductivity (85.2 %IACS) belonged to the TD sample.•The presence of θ-fiber and γ-fiber improved the electron conductivity of copper.