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Valence electronic structure on oxygen reduction reaction kinetics of Cu-doped Ba0.5Sr0.5FeO3−δ for IT-SOFCs

•Cu doping increased oxygen vacancies and valence electron concentrations of BSFCx.•A low area specific resistance of 0.084 Ω cm2 at 700 °C was achieved for BSFC0.2.•Cu doping improved the process of surface charge exchange and ion transfer. Ba0.5Sr0.5Fe1-xCuxO3-δ (BSFCx, x = 0–0.2) cathodes were in...

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Bibliographic Details
Published in:Materials letters 2024-10, Vol.372, p.136959, Article 136959
Main Authors: Lim, Taeheun, Jo, Kanghee, Kim, Yong-Nam, Lee, Heesoo
Format: Article
Language:English
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Summary:•Cu doping increased oxygen vacancies and valence electron concentrations of BSFCx.•A low area specific resistance of 0.084 Ω cm2 at 700 °C was achieved for BSFC0.2.•Cu doping improved the process of surface charge exchange and ion transfer. Ba0.5Sr0.5Fe1-xCuxO3-δ (BSFCx, x = 0–0.2) cathodes were investigated in the relationship between electronic structure and oxygen reduction reaction (ORR) kinetics. Electronic structure analysis revealed that Cu doping increased the oxygen vacancies (δ) from 0.384 (BSF) to 0.638 (BSFC0.2). The valence band maximum (VBM) shifted from 0.68 eV (BSF) to 0.24 eV (BSFC0.2), which implies a lower activation energy for charge transfer to the adsorbed oxygen. The area specific resistance was 0.042 Ω cm2 at 700 °C (BSFC0.2), a reduction of more than 50 % compared to 0.086 Ω cm2 (BSF). For the distribution of relaxation times analysis, BSFC0.2 showed the smallest peak area in medium frequency region, where the charge exchange and ion transfer occur at cathode.
ISSN:0167-577X
1873-4979
DOI:10.1016/j.matlet.2024.136959