Loading…

Temperature distribution and residual stress evolution at the interface of CuCrZr/316 L multi-material by laser powder bed fusion

•A three dimensional Gaussian semi-ellipsoidal heat source is loaded in the finite element simulation.•The thermal distribution of copper alloy and stainless steel formed on different substrate is investigated.•The influence of process parameters on thermal distribution and residual stress profile o...

Full description

Saved in:
Bibliographic Details
Published in:Optics and laser technology 2023-08, Vol.163, p.109355, Article 109355
Main Authors: Mao, Shenglan, Yang, Biqi, Liu, Gang, Liu, Genshen, Zhang, Zhengwen
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:•A three dimensional Gaussian semi-ellipsoidal heat source is loaded in the finite element simulation.•The thermal distribution of copper alloy and stainless steel formed on different substrate is investigated.•The influence of process parameters on thermal distribution and residual stress profile of LPBF fabricated copper-steel multi-material component is investigated. The defeats at the interface of copper/steel multi-material, such as cracks, are among the greatest challenges manufactured by Laser powder bed fusion (LPBF). Most of the previous researches have emphasized the impact of process parameters on the defeats of copper/steel multi-material interface by experimentation. It is significant to understand the thermal distribution and residual stress profile of copper/steel multi-material during LPBF process. In this work, a thermal–mechanical coupled finite element model is established to investigate the influence of process parameters on thermal distribution and residual stress evolution of the CuCrZr/316 L multi-material interface. The results are verified by characterization experiments. Results reveal that higher residual stress is caused by growing scanning speed. The maximum residual stress is at CuCrZr/316 L multi-material interface. Numerous cracks at the CuCrZr/316 L multi-material interface are attributed to excessive residual stress. This work can provide novel perspectives to understanding the residual stress of multi-materials in the LPBF process.
ISSN:0030-3992
1879-2545
DOI:10.1016/j.optlastec.2023.109355