Investigation of thermal effects in copper chemical mechanical polishing

• Published in: Precision engineering 2022-01, Vol.73, p.195-202
• Main Authors: Liu, Pengzhan, Bae, Sunghoon, Hong, Seokjun, Bae, Chulwoo, Seo, Hyeonmin, Lee, Jungryul, Tang, Cheng, Kim, Taesung
• Format: Article
• Language: English
• Subjects: Chemical mechanical polishing; Consumable; Slurry temperature; Thermal effect
• ISSN: 0141-6359; 1873-2372
• DOI: 10.1016/j.precisioneng.2021.08.022

With the demand for manufacturing large (e.g., 450 mm) wafers, problems arise due to temperature increases associated with the chemical mechanical polishing (CMP) process. Various methods have been employed to stabilize the in-situ polishing temperature. The use of a high-temperature slurry can improve the removal rate, but a degradation in surface morphology occurs during the copper CMP procedure. To explain this mechanism, the effects of temperature on the slurry, CMP pad, and copper wafer were separately investigated. A temperature of approximately 40 °C was demonstrated to be a suitable choice when considering polishing efficiency and quality, thereby facilitating the rapid production of semiconductors. Particle aggregation was also observed with a rise in temperature. The work presented here may allow for a reduction in defects during low-hardness material polishing. •High-temperature slurry can improve the removal rate during copper Chemical Mechanical Polishing.•Slurry temperature of approximately 40 °C was a suitable choice when considering polishing efficiency and quality of copper polishing.•Particles aggregation begin in the range of 65 °C to 67.5 °C and eventually aggregate into larger particles.•Higher temperatures softened pad asperities and increased the contact area between pad and wafer.