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A new method for judging thermal image quality with applications
Infrared thermal imaging, a non-destructive testing technology, measures the surface temperature of objects. Assessing thermal image quality is crucial for image monitoring, system design, algorithm optimization, and benchmarking. However, developing objective metrics that align with human perceptio...
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Published in: | Signal processing 2025-04, Vol.229, p.109769, Article 109769 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites |
Online Access: | Get full text |
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Summary: | Infrared thermal imaging, a non-destructive testing technology, measures the surface temperature of objects. Assessing thermal image quality is crucial for image monitoring, system design, algorithm optimization, and benchmarking. However, developing objective metrics that align with human perception is challenging due to the distinct structure of thermal images, which often feature high background temperatures and minimal variance between objects and the background. Existing methods typically target specific local features or overall image contrast, but new measures are needed to bridge the gap between objective performance and the unique characteristics of thermal images.
We propose a novel image quality assessment (IQA) method inspired by the human vision system, specifically designed for thermal images, harmonizing local and global data. The primary contributions include (1) innovative local, global, and hybrid thermal quality assessment methods that deliver precise image quality predictions without needing reference images, (2) an experimental analysis evaluating the developed blind thermal IQA measure’s applicability to various thermal images, and (3) a comprehensive analysis of traditional IQA measure-based methods applied to publicly accessible thermal databases. Extensive simulations demonstrate our method’s competitive performance and strong alignment with human perception of image quality.
•New metrics for blind thermal IQA at local, global, and combined scales.•Strong correlation with MOS under varied thermal image enhancements and distortions.•Evaluation of thermal IQA methods on various thermal databases. |
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ISSN: | 0165-1684 |
DOI: | 10.1016/j.sigpro.2024.109769 |