The effect of temperature on monocrystalline Si nanoindentation side effects: A molecular dynamics study

• Published in: Vacuum 2024-10, Vol.228, p.113453, Article 113453
• Main Authors: Li, Ziteng, Kang, Shuhao, Wu, Dongxu, Ren, Mingjun, Zhang, Xinquan, Lei, Jin, Zhu, Limin, Li, Duo
• Format: Article
• Language: English
• Subjects: Molecular dynamics simulation; Monocrystalline si; Nano-indentation; Temperature; Workpiece side effect
• ISSN: 0042-207X
• DOI: 10.1016/j.vacuum.2024.113453

Monocrystalline Si materials has been widely used in the fields of micro-electro-mechanical systems and electronic chips. At the micro and nanoscale, there are differences in the mechanical properties at the workpiece side compared to its interior. Meanwhile, temperature also has a significant impact on the mechanical properties of materials. In this paper, to analyze the effect of the temperature on the nanoindentation side effect of monocrystalline Si, a series of molecular dynamics (MD) simulations of nanoindentation are performed under six different temperatures. The simulation results show that the plastic deformation behavior, indentation force, internal stress, and the Internal defects are closely related to the temperature in nanoindentation. This work attributes a better understanding of the temperature effect on the nanoindentation side effect of the monocrystalline Si materials. •This study uses molecular dynamics simulations to investigate the impact of temperature on the nanoindentation side effect of monocrystalline Si.•The simulation results reveal that temperature closely correlates with plastic deformation, indentation force, internal stress, and defects in nanoindentation.•This study contributes to understanding the effect of temperature on the side effects of nanoindentation in single-crystal silicon materials.