Loading…
Toward lateral heterostructures with two-dimensional MoX 2 H 2 (X = As, Sb)
The development of two-dimensional (2D) lateral heterostructures (LHs) with the powerful tunability of electronic properties will be of great realistic significance for next-generation device applications. Herein, we report the novel 2D MoX 2 and MoX 2 H 2 (X = As or Sb) monolayer materials with exc...
Saved in:
Published in: | Physical chemistry chemical physics : PCCP 2020-10, Vol.22 (39), p.22584-22590 |
---|---|
Main Authors: | , , , |
Format: | Article |
Language: | English |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | The development of two-dimensional (2D) lateral heterostructures (LHs) with the powerful tunability of electronic properties will be of great realistic significance for next-generation device applications. Herein, we report the novel 2D MoX
2
and MoX
2
H
2
(X = As or Sb) monolayer materials with excellent stability. Using first-principles calculations, we demonstrated that 2D MoX
2
layers possess the metallic characteristic while the full surface hydrogenation effect would play a role in stabilizing the 2D lattices and lead to band gap openings of 0.83 and 0.50 eV for the 2D MoAs
2
H
2
and MoSb
2
H
2
, respectively. In addition, our results suggest that the 2D MoAs
2
H
2
and MoSb
2
H
2
can serve as the ‘building blocks’ to construct the seamless LHs exhibiting excellent thermal and dynamical stability. The obtained
n
L-MoAsSb LHs enable the fully tunable band gap engineering behavior with linear tendency as a function of the width of the in-plane components. The phase transition from direct to in-direct band gap was also confirmed in the LHs as the crucial value of
n
= 3. In view of the type-II band alignment and efficient carrier separation in
n
L-MoAsSb, the predicted MoX
2
H
2
and
n
L-MoAsSb LHs not only highlight the promising candidates for 2D pristine materials, but also paves the way for the realization of practical integrating device applications. |
---|---|
ISSN: | 1463-9076 1463-9084 |
DOI: | 10.1039/D0CP03530K |