Amalgams as Alternative Bonding Materials

Amalgams, which are mechanically alloyed mixes of a liquid metal with a powder, offer advantages in situations where large devices are to be bonded to materials with significant coefficient of expansion differences or where extremely temperature-sensitive devices are to be bonded. This is because th...

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Bibliographic Details
Published in:Soldering & surface mount technology 1990-02, Vol.2 (2), p.21-25
Main Author: MacKay, C.A
Format: Article
Language:English
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Summary:Amalgams, which are mechanically alloyed mixes of a liquid metal with a powder, offer advantages in situations where large devices are to be bonded to materials with significant coefficient of expansion differences or where extremely temperature-sensitive devices are to be bonded. This is because these materials will set or harden at or near room temperature to yield hard metallic bonds with melting points from 280°C up to ∼600°C depending upon the systems used. In this paper the results of a survey study of three binary systems of gallium with copper, nickel and silver are described. Wetting characteristics, bond strengths with and without metallisation, bulk properties including electrical and thermal properties and thermal cycle performance of joints are described. The feasibility of using these materials for bonding metallised and unmetallised surfaces of a variety of ceramics and semiconductors is clearly demonstrated.
ISSN:0954-0911
1758-6836
DOI:10.1108/eb037715