New dimensions in memory

A new 16Mb 3DM module has been developed that satisfies the requirements of high packaging density, high memory capacity, and low fabrication cost. The package density is four times that of TSOP. The module is fabricated by using four 4Mb-DRAM chips at low cost, and it is almost the same size as the...

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Bibliographic Details
Published in:IEEE circuits and devices magazine 1997-05, Vol.13 (3), p.24-26
Main Authors: Takahashi, N., Senba, N., Shimada, Y., Morizaki, H., Tokuno, K.
Format: Article
Language:English
Subjects:
Bonding
Ceramics
Costs
Electronics packaging
Fabrication
Glass
Packaging machines
Stacking
Temperature
Wires
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Description
Summary:A new 16Mb 3DM module has been developed that satisfies the requirements of high packaging density, high memory capacity, and low fabrication cost. The package density is four times that of TSOP. The module is fabricated by using four 4Mb-DRAM chips at low cost, and it is almost the same size as the single 4Mb-DRAM package (TSOP) currently in use. We also developed a new fabrication process for the module. A 3DM module has advantages in its size, high package density, and electrical performance. Applications that can utilize these advantages include supercomputers, workstations, memory cards, and space equipment.
ISSN:8755-3996
1558-1888
DOI:10.1109/101.589260