A new approach to designing electronic systems for operation in extreme environments: Part II - The SiGe remote electronics unit

We have presented the architecture, simulation, packaging, and over-temperature and radiation testing of a complex, 16-channel, extreme environment capable, SiGe Remote Electronics Unit containing the Remote Sensor Interface ASIC that can serve a wide variety of space-relevant needs as designed. The...

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Bibliographic Details
Published in:IEEE aerospace and electronic systems magazine 2012-07, Vol.27 (7), p.29-41
Main Authors: England, T. D., Diestelhorst, R. M., Kenyon, E. W., Cressler, J. D., Ramachandran, V., Alles, M., Reed, R., Berger, R., Garbos, R., Blalock, B., Mantooth, A., Barlow, M., Dai, F., Johnson, W., Ellis, C., Holmes, J., Webber, C., McCluskey, P., Mojarradi, M., Peltz, L., Frampton, R., Eckert, C.
Format: Magazinearticle
Language:English
Subjects:
Aircraft components
Avionics
Circuit layout
Computer architecture
Design methodology
Digital control
Electronic systems
Environmental factors
Extreme environments
Integrated circuits
Jupiter satellites
Lunar craters
Microprocessors
NASA
Radar remote sensing
Remote sensing
RSI
Silicon germanides
Space missions
Space vehicles
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Summary:We have presented the architecture, simulation, packaging, and over-temperature and radiation testing of a complex, 16-channel, extreme environment capable, SiGe Remote Electronics Unit containing the Remote Sensor Interface ASIC that can serve a wide variety of space-relevant needs as designed. These include future missions to the Moon and Mars, with the additional potential to operate in other hostile environments, including lunar craters and around the Jovian moon, Europa. We have expanded on the previous introduction of the RSI to show the validity of the chip design and performance over an almost 250 K temperature range, down to 100 K, under 100 krad TID radiation exposure, with SEL immunity and operability in a high-flux SET environment.
ISSN:0885-8985
1557-959X
DOI:10.1109/MAES.2012.6328839