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Novel Integrated Double pMOS SOI-LIGBT With Low Loss and High Short-Circuit Capability
An ultralow loss lateral insulated gate bipolar transistor (LIGBT) with high short-circuit capability is proposed and investigated by simulations. The proposed LIGBT features integrated double pMOS at the cathode side of a conventional LIGBT (Con. LIGBT) (named as IDP LIGBT), wherein pMOS1 is the de...
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Published in: | IEEE transactions on electron devices 2024-11, Vol.71 (11), p.7199-7203 |
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Main Authors: | , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites |
Online Access: | Get full text |
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Summary: | An ultralow loss lateral insulated gate bipolar transistor (LIGBT) with high short-circuit capability is proposed and investigated by simulations. The proposed LIGBT features integrated double pMOS at the cathode side of a conventional LIGBT (Con. LIGBT) (named as IDP LIGBT), wherein pMOS1 is the depletion mode and pMOS2 is the enhancement mode. The potential {V}_{\text {P}} / {V}_{\text {N}} of cathode P+/N+ regions are self-adaptively modulated by the pMOS2 and pMOS1. In the on -state, the parasitic diode {D}1 (p-well/cathode N+ region) of IDP LIGBT is turned on to enhance the conductivity modulation effect and then achieve a low on -state voltage drop ( {V}_{\text {on}} ). During the turning off period, the pMOS2 is turned on before the main gate of LIGBT turning off to extract holes from the p-well quickly and decrease the {V}_{\text {P}} , which turns off {D}1 and makes less carriers needed to be extracted. Meanwhile, the pMOS1 channel is self-adaptively narrowed and depleted with the increasing {V}_{\text {AK}} , which elevates the {V}_{\text {N}} and then reduces the cathode electron injection efficiency. Therefore, the IDP LIGBT achieves an ultrafast switching speed and a low turnoff loss ( {E}_{\text {off}} ). In the short-circuit state with high V_{\text {AK}} , the pMOS1 is self-adaptively pinched off to reduce cathode electron injection efficiency and saturation current, so as to achieve a better short-circuit withstanding time ( {t}_{\text {SC}} ). Compared with the MOS resistor (MR) LIGBT, the IDP LIGBT decreases the {E}_{\text {off}} / {V}_{\text {on}} |
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ISSN: | 0018-9383 1557-9646 |
DOI: | 10.1109/TED.2024.3454035 |