Dominant Coupling Mechanism for Integrated Circuit Immunity of SOIC Packages Up To 10 GHz

As the frequency of functional signals and interfering fields is rising beyond 1 GHz, the immunity of integrated circuits (ICs) against these higher frequencies is interesting. To design test setups that mimic the real-world interference an IC may receive, the dominant coupling mechanism (radiation...

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Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2018-08, Vol.60 (4), p.965-970
Main Authors: Land, Sjoerd Op 't, Ramdani, Mohamed, Perdriau, Richard
Format: Article
Language:English
Subjects:
Couplings
Electromagnetic compatibility (EMC)
Electromagnetism
Electronics
Engineering Sciences
gigahertz direct power injection (GDPI)
gigahertz transverse electro magnetic (GTEM)
immunity
Immunity testing
integrated circuit
integrated circuit immunity model for conducted immunity (ICIM-CI)
integrated circuit immunity model for radiated immunity (ICIM-RI)
Integrated circuit modeling
modeling
Pins
Power measurement
return on modeling effort (ROME)
Transmission line measurements
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Summary:As the frequency of functional signals and interfering fields is rising beyond 1 GHz, the immunity of integrated circuits (ICs) against these higher frequencies is interesting. To design test setups that mimic the real-world interference an IC may receive, the dominant coupling mechanism (radiation or conduction) needs to be known. We hypothesize that the dominant coupling mechanism is conduction for small outline integrated circuit (SOIC) packages up to about 10 GHz. To challenge this hypothesis, the radiated immunity of a printed circuit board trace connected to a voltage regulator IC is predicted and measured. The radiated immunity is predicted to be the product of the field-to-trace attenuation and the conducted immunity of the IC, thus neglecting the radiated immunity of the IC. As far as could be measured, the prediction correlated well with measurement, so the dominant-conduction hypothesis was not falsified with this case study.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2017.2756915