Loading…
Effect of hydrogen radicals on the reduction of carbon incorporation into GaAs grown by using trimethylgallium
Carbon incorporation into GaAs grown under an ultra-high vacuum (UHV) environment was investigated in a trimethylgallium (TMGa)-As 4 or AsH 3 (cracked at 850° C) system with hydrogen molecules ( H 2 ) or hydrogen radicals ( H•). The residual carbon concentrations in GaAs layers grown at a substrate...
Saved in:
Published in: | Japanese Journal of Applied Physics 1994-07, Vol.33 (7A), p.3825-3829 |
---|---|
Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | Carbon incorporation into GaAs grown under an ultra-high vacuum (UHV) environment was investigated in a trimethylgallium (TMGa)-As
4
or AsH
3
(cracked at 850° C) system with hydrogen molecules ( H
2
) or hydrogen radicals ( H•). The residual carbon concentrations in GaAs layers grown at a substrate temperature of 490° C were measured by secondary ion mass spectrometry (SIMS). In the case of GaAs growth by simultaneous source supply, the introduction of H• reduced the residual carbon concentrations in epitaxial layers from 8×10
19
to 7×10
18
cm
-3
for TMGa-As
4
, and from 4×10
19
to 5×10
18
cm
-3
for TMGa-AsH
3
. In the case of an alternating source sup- ply of TMGa and AsH
3
without hydrogen, a higher level of carbon concentrations ( 1–2×10
20
cm
-3
) than that of the simultaneous source supply case was observed irrespective of the purge duration (10–250 s) of TMGa in UHV. The residual carbon concentrations were reduced to 6×10
18
cm
-3
by the injection of H• after TMGa-exposure in an alternating supply cycle, although H
2
did not affect the carbon incorporation. This result indicates that the adsorbed carbon-containing species derived from TMGa, which has a residence time of more than 600 s on GaAs surfaces, can be desorbed by a reaction with H• . |
---|---|
ISSN: | 0021-4922 1347-4065 |
DOI: | 10.1143/jjap.33.3825 |