Pulse Plating of Copper from Deep Eutectic Solvents

The effect of pulse parameters on the deposition of copper from a chloride-based deep eutectic solvent (DES) was investigated. While satisfactory deposits could be obtained for some pulse conditions, at small duty cycles or long off-times the current efficiencies obtained were very low. These findin...

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Bibliographic Details
Published in:ECS transactions 2017-01, Vol.77 (11), p.1247-1253
Main Authors: Green, Todd, Su, Xiaomeng, Roy, Sudipta
Format: Article
Language:English
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Summary:The effect of pulse parameters on the deposition of copper from a chloride-based deep eutectic solvent (DES) was investigated. While satisfactory deposits could be obtained for some pulse conditions, at small duty cycles or long off-times the current efficiencies obtained were very low. These findings were consistent with a corrosion process occurring during the off-time, most likely the comproportionation reaction: Cu + CuIICl42- -> 2CuICl2-. Initial experimental results were consistent with the corrosion rate being controlled by the transport of the CuIICl42- species to the electrode surface. With this assumption, a simple corrosion model was developed to account for the observed loss in current efficiency as a function of the pulse conditions. While this model broadly predicts the observed results some discrepancy between the observed and measured were noted.
ISSN:1938-5862
1938-6737
1938-6737
1938-5862
DOI:10.1149/07711.1247ecst