Mechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion

Samples of commercially pure copper (ETP copper) were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. Microstructural evolution was determined by oriented image microscopy (OIM) and differential scanning calorimetry (DSC) was used to est...

Full description

Saved in:
Bibliographic Details
Published in:Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2013-06, Vol.571, p.103-114
Main Authors: Higuera-Cobos, O.F., Cabrera, J.M.
Format: Article
Language:English
Subjects:
Applied sciences
Copper
Cross-disciplinary physics: materials science
rheology
Differential scanning calorimetry (DSC)
Elasticity. Plasticity
Electric properties
Electrical conductivity
Electron backscattered diffraction (EBSD)
Enginyeria dels materials
Equal channel angular pressing (ECAP)
Exact sciences and technology
Materials
Materials conductors
Materials electrotècnics
Materials science
Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology
Metals. Metallurgy
Other heat and thermomechanical treatments
Physics
Treatment of materials and its effects on microstructure and properties
Àrees temàtiques de la UPC
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Samples of commercially pure copper (ETP copper) were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. Microstructural evolution was determined by oriented image microscopy (OIM) and differential scanning calorimetry (DSC) was used to estimate the stored deformation energy and the recrystallization temperature after each ECAP pass. On the other hand, electrical properties were correlated with the associated energy that results from the defects induced by ECAP. Results show that the stored energy rises on increasing ECAP deformation, while the recrystallization temperature decreases significatively. Also, mechanical properties after each pass were evaluated by tensile tests. Microstructural and mechanical features display that a stable microstructure is attained after four passes. Similarly, electrical conductivity decreases up to a saturation state at increasing ECAP passes.
ISSN:0921-5093
1873-4936
DOI:10.1016/j.msea.2013.01.076