Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites

Carbon/aluminium (C/Al) composites have the advantages of low density and high electrical conductivity, which have potential applications in aerospace, rail transportation and other fields. However, the unstable bonding of the C/Al interface and significant thermal expansion differences have resulte...

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Bibliographic Details
Published in:High voltage 2022-10, Vol.7 (5), p.960-967
Main Authors: Wei, Wenfu, Huang, Zhanglin, Yin, Guofeng, Yang, Zefeng, Li, Xiaobo, Zuo, Haozi, Deng, Qin, Huang, Guizao, Ren, Junwen, Liao, Qianhua, Yang, Yan, Wu, Guangning
Format: Article
Language:English
Subjects:
Alloys
Aluminum
Bonding strength
Carbon
Composite materials
Contact angle
Electrical resistivity
Flexural strength
High temperature
Interfaces
Interfacial bonding
Interlayers
Mechanical properties
Morphology
Shock resistance
Shock tests
Silicon carbide
Thermal expansion
Thermal resistance
Thermal shock
Wettability
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Summary:Carbon/aluminium (C/Al) composites have the advantages of low density and high electrical conductivity, which have potential applications in aerospace, rail transportation and other fields. However, the unstable bonding of the C/Al interface and significant thermal expansion differences have resulted in risks of the composites' failure once suffering from severe thermal shock. In this work, the C/Al composites were prepared by the pressure impregnation method, and silicon (Si) was added to overcome the problems of C/Al non‐wettability and thermal expansion differences. The effects of mass fractions of doped silicon on the mechanical properties, electrical conductivity and thermal shock resistance of C/Al composites were also examined. Results show that the formed SiC interlayer has effectively enhanced the interfacial bonding and reduced the differences in the thermal expansion coefficient of each component. As a result, the thermal shock resistance of the composites has been remarkably improved, and the flexural strength could remain 90% of the original level after the thermal shock test, compared with 50% of that without Si doping.
ISSN:2397-7264
2397-7264
DOI:10.1049/hve2.12190