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Direct imaging and electronic structure modulation of moiré superlattices at the 2D/3D interface

The atomic structure at the interface between two-dimensional (2D) and three-dimensional (3D) materials influences properties such as contact resistance, photo-response, and high-frequency electrical performance. Moiré engineering is yet to be utilized for tailoring this 2D/3D interface, despite its...

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Bibliographic Details
Published in:Nature communications 2021-02, Vol.12 (1), p.1290-1290, Article 1290
Main Authors: Reidy, Kate, Varnavides, Georgios, Thomsen, Joachim Dahl, Kumar, Abinash, Pham, Thang, Blackburn, Arthur M., Anikeeva, Polina, Narang, Prineha, LeBeau, James M., Ross, Frances M.
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Language:English
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Summary:The atomic structure at the interface between two-dimensional (2D) and three-dimensional (3D) materials influences properties such as contact resistance, photo-response, and high-frequency electrical performance. Moiré engineering is yet to be utilized for tailoring this 2D/3D interface, despite its success in enabling correlated physics at 2D/2D interfaces. Using epitaxially aligned MoS 2 /Au{111} as a model system, we demonstrate the use of advanced scanning transmission electron microscopy (STEM) combined with a geometric convolution technique in imaging the crystallographic 32 Å moiré pattern at the 2D/3D interface. This moiré period is often hidden in conventional electron microscopy, where the Au structure is seen in projection. We show, via ab initio electronic structure calculations, that charge density is modulated according to the moiré period, illustrating the potential for (opto-)electronic moiré engineering at the 2D/3D interface. Our work presents a general pathway to directly image periodic modulation at interfaces using this combination of emerging microscopy techniques. Here, advanced scanning transmission electron microscopy techniques are used to image the atomic structure at the interface between 2D MoS 2 and 3D Au nanoislands, revealing a moiré superlattice and illustrating the potential for (opto-)electronic moiré engineering at the 2D/3D interface.
ISSN:2041-1723
2041-1723
DOI:10.1038/s41467-021-21363-5