RLC Circuit Forecast in Analog IC Packaging and Testing by Machine Learning Techniques

• Published in: Micromachines (Basel) 2022-08, Vol.13 (8), p.1305
• Main Authors: Lai, Jung-Pin, Lin, Ying-Lei, Lin, Ho-Chuan, Shih, Chih-Yuan, Wang, Yu-Po, Pai, Ping-Feng
• Format: Article
• Language: English
• Subjects: Accuracy; Algorithms; Analog circuits; Artificial neural networks; Back propagation; Back propagation networks; Buried structures; Capacitance; Circuit boards; Circuit printing; Computer simulation; Data collection; Design optimization; Design techniques; Designers; Electric fields; Electric power; Electricity generation; Electronic components; Electronic components industry; Electronic packaging; Error analysis; Forecasting; Genetic algorithms; Heat; Inductance; integrated circuit; Integrated circuits; LSSVR; Machine learning; Mathematical models; Methods; Neural networks; Package design; Packaging; packaging and testing; Printed circuit boards; Printed circuits; Risk assessment; RLC circuits; Semiconductor chips; Semiconductor industry; Semiconductors; Simulation; Simulation methods; Support vector machines; Task complexity
• ISSN: 2072-666X; 2072-666X
• DOI: 10.3390/mi13081305

For electronic products, printed circuit boards are employed to fix integrated circuits (ICs) and connect all ICs and electronic components. This allows for the smooth transmission of electronic signals among electronic components. Machine learning (ML) techniques are popular and employed in various fields. To capture the nonlinear data patterns and input–output electrical relationships of analog circuits, this study aims to employ ML techniques to improve operations from modeling to testing in the analog IC packaging and testing industry. The simulation calculation of the resistance, inductance, and capacitance of the pin count corresponding to the target electrical specification is a complex process. Tasks include converting a two-dimensional circuit into a three-dimensional one in simulation and modeling-buried structure operations. In this study, circuit datasets are employed for training the ML model to predict resistance (R), inductance (L), and capacitance (C). The least squares support vector regression (LSSVR) with Genetic Algorithms (GA) (LSSVR-GA) serves as an ML model for forecasting RLC values. Genetic algorithms are used to select parameters of LSSVR models. To demonstrate the performance of LSSVR models in forecasting RLC values, three other ML models with genetic algorithms, including backpropagation neural networks (BPNN-GA), random forest (RF-GA), and eXtreme gradient boosting (XGBoost-GA), were employed to cope with the same data. Numerical results illustrated that the LSSVR-GA outperformed the three other forecasting models by around 14.84% averagely in terms of mean absolute percentage error (MAPE), weighted absolute percent error measure (WAPE), and normalized mean absolute error (NMAE). This study collected data from an IC packaging and testing firm in Taiwan. The innovation and advantage of the proposed method is using a machine approach to forecast RLC values instead of through simulation ways, which generates accurate results. Numerical results revealed that the developed ML model is effective and efficient in RLC circuit forecasting for the analog IC packaging and testing industry.