Stable microcrystalline silicon thin-film transistors produced by the layer-by-layer technique

Microcrystalline silicon thin films prepared by the layer-by-layer technique in a standard radio-frequency glow discharge reactor were used as the active layer of top-gate thin-film transistors (TFTs). Crystalline fractions above 90% were achieved for silicon films as thin as 40 nm and resulted in T...

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Bibliographic Details
Published in:Journal of applied physics 1999-12, Vol.86 (12), p.7079-7082
Main Authors: Roca i Cabarrocas, P., Brenot, R., Bulkin, P., Vanderhaghen, R., Drévillon, B., French, I.
Format: Article
Language:English
Subjects:
Engineering Sciences
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Summary:Microcrystalline silicon thin films prepared by the layer-by-layer technique in a standard radio-frequency glow discharge reactor were used as the active layer of top-gate thin-film transistors (TFTs). Crystalline fractions above 90% were achieved for silicon films as thin as 40 nm and resulted in TFTs with smaller threshold voltages than amorphous silicon TFTs, but similar field effect mobilities of around 0.6 cm2/V s. The most striking property of these microcrystalline silicon transistors was their high electrical stability when submitted to bias-stress tests. We suggest that the excellent stability of these TFTs, prepared in a conventional plasma reactor, is due to the stability of the μc-Si:H films. These TFTs can be used in applications that require high stability for which a-Si:H TFTs cannot be used, such as multiplexed row and column drivers in flat-panel display applications, and active matrix addressing of polymer light-emitting diodes.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.371795