Thermal Design of Direct Cooling Power Module for EV Applications

Because electric vehicle power modules must adapt to harsh environments and meet 15-year life requirements, thermal management of the power module becomes a critical challenge. The direct cooling type of power module can eliminate the thermal interface material and reduce the thermal resistance of t...

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Bibliographic Details
Main Authors: Liu, Chun-Kai, Chen, Yao-Shun, Huang, Yuan-Cheng, Chang, Tan-Yi, Hsing, Jia-Shuo
Format: Conference Proceeding
Language:English
Subjects:
Linear programming
Multichip modules
Silicon carbide
Temperature dependence
Temperature distribution
Temperature measurement
Thermal resistance
Online Access:Request full text
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Summary:Because electric vehicle power modules must adapt to harsh environments and meet 15-year life requirements, thermal management of the power module becomes a critical challenge. The direct cooling type of power module can eliminate the thermal interface material and reduce the thermal resistance of the power module. However, improving the thermal performance of power modules requires enhancing the heat sink design. In this paper, we study the thermal design of the 1200V, 400A SiC power module for EV/HEV applications by numerical simulation and experimental measurement. The optimum design of the circular pin fin is analyzed by the Multi-parameter Optimization (HEEDS) method and SHERPA algorithm. The objective functions are junction temperature and pressure drop and the variable parameters are pin diameter, pin pitch, and pin height. Results show that the minimum junction temperature can be obtained under a large pressure drop. By using the optimum design with the targets of low junction temperature and pressure drop, the junction temperature and thermal resistance can be reduced under acceptable pressure drop. The optimum design curve of the pin fin heat sink of the direct cooling power module can be obtained.
ISSN:2150-5942
DOI:10.1109/IMPACT59481.2023.10348750