On Improving Defect Coverage of Stuck-at Fault Tests

• Main Authors: Miyase, K., Terashima, K., Kajihara, S., Wen, X., Reddy, S.M.
• Format: Conference Proceeding
• Language: English
• Subjects: Circuit faults; Circuit testing; Design for manufacture; Feeds; Information analysis; Manufacturing processes; Sequential analysis; Sequential circuits; Silicon; Very large scale integration
• ISSN: 1081-7735; 2377-5386
• DOI: 10.1109/ATS.2005.84

Recently design for manufacturability (DFM) has been required to achieve higher process yield. Information obtained from silicon by testing and/or fault analysis is sometimes fed back for redesign of VLSI circuits. In this paper we propose a method to maximize defect coverage of a test set initially generated for stuck-at faults in a full scan sequential circuit by using feed back information from fault analysis. If a test set for more complex faults than stuck-at faults is generated, higher defect coverage would be obtained. Such a test set, however, would have a large number of test vectors, and hence the test costs would go up. The proposed method improves defect coverage of the test set by not adding new test vectors but modifying test vectors with the information obtained from fault analysis. Therefore there are no negative impacts on test data volume and test application time. The initial fault coverage for stuck-at faults of the test set is guaranteed with modified test vectors. In this paper we focus on detecting as many as possible non-feedback AND/OR-type bridging faults. Experimental results show that the proposed method significantly decreases the number of non-feedback AND/OR-type bridging faults undetected by a test set generated for stuck-at faults