Thermal effects of ovenized clocks on episeal encapsulated inertial measurement units

In this paper, we demonstrate the thermal effects of micro-ovenized clocks embedded in the device layer of a vacuum sealed MEMS inertial measurement unit. We demonstrate a novel in-plane suspension and heater that provides improved thermal isolation within a mm-scale chip, compared to in-cap heaters...

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Bibliographic Details
Main Authors: Ortiz, Lizmarie Comenencia, Flader, Ian B., Vukasin, Gabrielle D., Gerrard, Dustin D., Chandorkar, Saurabh A., Rodriguez, Janna, Shin, Dongsuk D., Kwon, Ryan, Heinz, David B., Chen, Yunhan, Park, Woosung, Goodson, Kenneth E., Kenny, Thomas W.
Format: Conference Proceeding
Language:English
Subjects:
Accelerometers
Heating systems
Micromechanical devices
Resonant frequency
Resonators
Temperature sensors
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Summary:In this paper, we demonstrate the thermal effects of micro-ovenized clocks embedded in the device layer of a vacuum sealed MEMS inertial measurement unit. We demonstrate a novel in-plane suspension and heater that provides improved thermal isolation within a mm-scale chip, compared to in-cap heaters. We show the interaction of three resonators within a single die: an ovenized tuning fork, a resonant accelerometer, and a disk resonating gyroscope. We demonstrate that a device layer micro-oven, which operates at a tenth of the power of an encapsulation cap-layer micro-oven, has very small effects on the frequency of the other resonators in the die, thus proving good thermal isolation in our structures. We show that the in-plane heater isolation provides more than a 15X reduction of frequency deviation of adjacent sensors.
ISSN:2160-1968
DOI:10.1109/MEMSYS.2018.8346722