KrF excimer laser annealing with an ultra-low laser fluence for enabling ferroelectric Hf0.5Zr0.5O2
In this letter, we report the KrF excimer laser annealing for achieving high-performance ferroelectric Hf 0.5 Zr 0.5 O 2 (HZO). The laser anneals the target device layer effectively with a high heating/cooling rate without overheating under-layer deep structures. The impact of laser fluence, number...
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| Published in: | IEEE electron device letters 2023-01, p.1-1 |
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| Main Authors: | , , , , , , |
| Format: | Article |
| Language: | English |
| Subjects: | |
| Online Access: | Get full text |
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