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CFD simulation of the multiphase heat transfer during the quenching process
The paper presents the results of the CFD (Computational Fluid Dynamics) simulation of quenching process for the ring shape sample. The aim of the work is to develop and validate the methodology for multiphase CFD simulation including the boiling during the quenching process. CFD simulation is provi...
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Published in: | IOP conference series. Materials Science and Engineering 2020-01, Vol.723 (1), p.12022 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that cite this one |
Online Access: | Get full text |
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Summary: | The paper presents the results of the CFD (Computational Fluid Dynamics) simulation of quenching process for the ring shape sample. The aim of the work is to develop and validate the methodology for multiphase CFD simulation including the boiling during the quenching process. CFD simulation is provided in ANSYS Fluent. The Lee model is used for modelling the phase change during the quenching process. The first step consider the simulation of cooling of the ring sample when the correct model parameters will be found. Validation of results is performed by comparison with experimental data. Experimental was realized inside the own designed quenching bath device filled with quenching polymer. The general description of the experimental setup is included in the paper. The CFD results are cooling curves, i.e. variation of solid temperature on time. The Lee model parameters especially the evaporation frequency was tuned. Thin polymer film on the solid surface was considered to bring the results closer to the experimental data. The comparison between experiment and CFD shows very good agreement for higher temperatures, which covers the boiling stage. On the other hand for lower temperatures worse match of results was found caused probably by the sensitivity on the inlet velocity profile settings. Some recommendations for future work were defined. |
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ISSN: | 1757-8981 1757-899X |
DOI: | 10.1088/1757-899X/723/1/012022 |